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M74HC04RM13TR

STMicroelectronics

M74HC04RM13TR by STMicroelectronics

STMicroelectronics M74HC04RM13TR is a CMOS Logic Gates IC with 6 functions, 29ns propagation delay, and 4.5V nominal voltage. Ideal for military-grade applications, it features a small outline package with dual terminals and can operate in temperatures ranging from -55 to 125 °C.

Median Price

$3.640

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 173 parts In-Stock

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$1.150

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$0.870

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$0.750

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Forefront Electronics and Design

USA . 3 parts In-Stock

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$6.130

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SPM Sales

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Sinequanon

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Pegasus Components GmbH

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Martec Srl

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ComSIT Distribution GmbH

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Digiode

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Q Components

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

USA . 2,468 parts In-Stock

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Atlantic Semiconductor

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Anansix

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R&J Components

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Sensible Micro Corp

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Vyrian

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Rebound Electronics

UK . 1,544 parts In-Stock

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LWI Electronics Inc

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Ashlea Components Ltd

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Inventory MP

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Microchip USA

USA . 352 parts In-Stock

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$2.618

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AZTECH Wire

Italy . 1,187 parts In-Stock

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$17.810

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

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$26.265

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MKK Technologies

India . 1,952 parts In-Stock

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$49.390

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DigiPath Technology Company

USA . 1,952 parts In-Stock

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$49.390

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Component Stockers USA

USA . 481 parts In-Stock

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Perfect Parts

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Kepictronics

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Infinite Electronics LLP (Excess)

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Metaverse IC Inc.

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Cyclops Electronics Ltd (Excess)

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Alle Elektronik GmbH

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Corphita

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Parana Technologies

USA . 1,526 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 665 parts In-Stock

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Overview

Discover the innovative M74HC04RM13TR logic gates by STMicroelectronics, offering unmatched quality and reliability. With its compact design and advanced technology, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile component delivers exceptional performance and efficiency. Trust in STMicroelectronics' expertise to provide you with the best solutions for your projects. Experience the value and benefits of the M74HC04RM13TR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 29 ns

Fast operation speed, ensuring quick response times for logic functions.

Surface Mount: YES

Can be easily mounted on circuit boards, saving space and making assembly more efficient.

No. of Functions: 6

Versatile with multiple logic functions integrated into one component.

Nominal Supply Voltage / Vsup (V): 4.5

Stable supply voltage for consistent performance.

Load Capacitance (CL): 50 pF

Optimized for handling a specific range of capacitance, ensuring reliable operation.

Power Supplies (V): 2/6

Compatible with different power supply voltages, offering flexibility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design with a low profile, ideal for space-constrained applications.

Maximum I (ol): 4 Amp

High output current capability for driving external loads.

Propagation Delay (tpd): 110 ns

Consistent delay time for predictable logic operations.

Temperature Grade: MILITARY

Suitable for harsh environments and military applications.

Technology: CMOS

Low power consumption and high noise immunity, suitable for various electronic systems.

Technical Specifications

Logic Gates M74HC04RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

M74HC04RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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