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M34C02-RMB6TG

STMicroelectronics

M34C02-RMB6TG by STMicroelectronics

M34C02-RMB6TG by STMicroelectronics is a compact EEPROM with a 256x8 organization, operating b/w -40 °C to 85 °C. It features I2C interface for easy integration and offers hardware/software write protection. Ideal for industrial applications, it supports up to 1M write/erase cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,603 parts In-Stock

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8,603

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Digiode

USA . 1,990 parts In-Stock

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1,990

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Anansix

USA . 1,985 parts In-Stock

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1,985

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 517 parts In-Stock

1+ parts

$5.199

100+ parts

-

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$4.679

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517

$5.199

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$4.679

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MKK Technologies

India . 935 parts In-Stock

1+ parts

$9.776

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935

$9.776

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DigiPath Technology Company

USA . 935 parts In-Stock

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$9.776

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935

$9.776

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AZTECH Wire

Italy . 1,156 parts In-Stock

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$21.480

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1,156

$21.480

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Microchip USA

USA . 298 parts In-Stock

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$81.716

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298

$81.716

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Component Stockers USA

USA . 703 parts In-Stock

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$99.990

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703

$99.990

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Kepictronics

USA . 1,627 parts In-Stock

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Corphita

USA . 887 parts In-Stock

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Parana Technologies

USA . 205 parts In-Stock

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$6.216

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205

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$6.216

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Overview

Unlock unparalleled data storage solutions with the M34C02-RMB6TG EEPROM from STMicroelectronics, a leader in innovative semiconductor technology. This ultra-reliable memory chip excels in diverse applications, from industrial automation to consumer electronics, ensuring robust performance even in extreme conditions. Enjoy seamless integration, compact design, and exceptional endurance with up to 1 million write cycles. Elevate your projects with proven quality and efficiency—choose STMicroelectronics for peace of mind and superior value!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization on PCB, ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular shape is suitable for various layouts, enhancing compatibility with different circuit designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfers, improving performance in time-sensitive applications.

Nominal Supply Voltage / Vsup: 2.2 V

This low nominal supply voltage supports energy-efficient designs, reducing power consumption.

Power Supplies (V): 2/5

Versatility in operating voltage allows integration into both low-power and standard voltage systems.

No. of Terminals: 8

The 8-terminal configuration balances complexity with functionality, making it suitable for various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile allow for high-density mounting in space-constrained devices.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature makes it suitable for industrial applications in harsh environments.

Organization: 256X8

Organized memory structure facilitates easy addressing and management of stored data.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures ensures reliable performance in extreme conditions.

I2C Control Byte: 1010DDDR

I2C control compatibility allows for easy integration with various microcontrollers and peripherals.

Terminal Position: DUAL

Dual terminal position enhances flexibility for layout designs and routing options in PCBs.

Write Protection: HARDWARE/SOFTWARE

Dual write protection enhances data integrity, securing critical information from unintended modifications.

Maximum Seated Height: 0.6 mm

A low seated height supports slim form factor designs, making it suitable for portable devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

The reasonable clock frequency provides an adequate balance of speed and power consumption.

Width: 2 mm

The compact width makes it ideal for use in space-restricted applications.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at low supply voltage contributes to overall energy efficiency in applications.

Length: 3 mm

The short length complements its compact profile, suitable for modern miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates reliability and durability for challenging environments.

Technology: CMOS

CMOS technology ensures low power consumption and high scalability for various applications.

Parallel or Serial: SERIAL

Serial interface reduces pin count and simplifies wiring, which is advantageous in tight spaces.

Terminal Form: NO LEAD

No lead format minimizes footprint and improves solderability, especially in automated assembly.

Maximum Supply Current: 1 mA

Low supply current minimizes overall power consumption, enhancing battery life in portable devices.

No. of Words: 256 words

The memory capacity of 256 words caters to a variety of data storage needs in different applications.

Memory Width: 8

An 8-bit wide memory allows efficient data handling and optimal compatibility with popular data interfaces.

Minimum Data Retention Time: 40 years

Long data retention ensures stability of information over extended periods, critical for archival applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for densely populated boards and aids in high-density applications.

No. of Words Code: 256

The alignment with data organization allows for straightforward programming and retrieval.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate at higher supply voltages increases flexibility across different design requirements.

Endurance: 1,000,000 Write/Erase Cycles

High endurance makes this EEPROM suitable for applications that require frequent data updates.

Serial Bus Type: I2C

I2C bus type enables easy communication with multiple devices while keeping wiring simple.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time improves system responsiveness, which is beneficial for real-time applications.

Memory Density: 2048 bit

Significant memory density supports various complex data storage needs without impacting space.

Memory IC Type: EEPROM

The EEPROM type is non-volatile, ensuring data persistence even when power is removed.

Maximum Standby Current: 0.0000005 Amp

Extremely low standby current enhances overall energy efficiency, making it suitable for battery-powered devices.

Technical Specifications

EEPROM M34C02-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-XDSO-N8

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34C02-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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