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M29F010B70K6E

STMicroelectronics

M29F010B70K6E by STMicroelectronics

M29F010B70K6E from STMicroelectronics is a 1Mb NOR Flash memory with a 5V supply, featuring an asynchronous operating mode and 70 ns max access time. It supports industrial applications with -40 °C to 85 °C temp range and offers 100k write/erase cycles. This compact chip carrier design ensures reliable performance in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip Stock

USA . 19,100 parts In-Stock

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Vyrian

USA . 4,593 parts In-Stock

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Digiode

USA . 1,585 parts In-Stock

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Anansix

USA . 1,146 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 135 parts In-Stock

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Pegasus Components GmbH

Germany . 24 parts In-Stock

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ComSIT Distribution GmbH

Germany . 16 parts In-Stock

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J2 Sourcing AB

Sweden . 12 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 670 parts In-Stock

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$3.999

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$3.599

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670

$3.999

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$3.599

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MKK Technologies

India . 1,396 parts In-Stock

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$7.520

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DigiPath Technology Company

USA . 1,396 parts In-Stock

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$7.520

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AZTECH Wire

Italy . 289 parts In-Stock

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$8.070

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Component Stockers USA

USA . 386 parts In-Stock

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$99.990

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Kepictronics

USA . 23,526 parts In-Stock

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Microchip USA

USA . 6,808 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,153 parts In-Stock

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Parana Technologies

USA . 2,007 parts In-Stock

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$4.782

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Corphita

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Overview

Elevate your projects with the M29F010B70K6E from STMicroelectronics, a leader in innovation and quality. This versatile flash memory offers exceptional reliability and endurance, making it ideal for a wide range of applications—from industrial automation to consumer electronics. Enjoy seamless performance in demanding environments, ensuring that your designs are both robust and efficient. Trust in STMicroelectronics to deliver unmatched value and peace of mind for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, the plastic/epoxy material ensures reliability in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on the circuit board, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into standard PCB layouts.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access and improved performance in read operations.

Nominal Supply Voltage / Vsup: 5V

Standard voltage level makes it compatible with a wide range of systems and simplifies power supply design.

Power Supplies (V): 5

Single power supply for operation simplifies the design and reduces component count.

No. of Terminals: 32

A higher number of terminals provides more connection points for improved functionality and flexibility.

Package Style (Meter): CHIP CARRIER

Chip carrier style allows for better heat dissipation and mechanical stability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes it suited for industrial applications where heat resistance is crucial.

Organization: 128KX8

This organization structure provides a balanced memory architecture, optimizing both performance and capacity.

Minimum Operating Temperature: -40 °C

Wide operational temperature range ensures functionality in extreme conditions, making it ideal for outdoor and industrial applications.

No. of Sectors/Size: 8

Multiple sectors allow for efficient memory management and organization of data.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal positioning allows for more flexibility and optimal routing on PCB design.

Maximum Seated Height: 3.56 mm

Compact height helps in space-constrained applications, enabling a more efficient design.

Width: 11.43 mm

Moderate width supports easy mounting on various circuit designs.

Minimum Supply Voltage (Vsup): 4.5V

Low minimum supply voltage enhances compatibility with lower power systems.

Maximum Time At Peak Reflow Temperature (s): 40

Short peak reflow time reduces the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance ensures reliability during soldering processes.

Type: NOR TYPE

NOR flash type architecture allows for fast random access, ideal for code storage and execution.

Length: 13.97 mm

Compact length enables integration in tight spaces and small electronic devices.

Programming Voltage (V): 5

Standard programming voltage simplifies the interfacing with existing systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robust performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it energy-efficient.

Parallel or Serial: PARALLEL

Parallel interfacing provides faster data transfer rates, enhancing overall performance.

Terminal Form: J BEND

J bend terminals simplify soldering and improve mechanical stability on the PCB.

Sector Size (Words): 16K

Large sector size enhances data organization and management efficiency.

Maximum Supply Current: 20 mA

Relatively low supply current ensures power efficiency, making it suitable for battery-operated devices.

No. of Words: 131072 words

Ample storage capacity for a variety of applications, accommodating large data requirements.

Toggle Bit: YES

Toggle bit feature improves memory interface flexibility and ensures easier management of data states.

Memory Width: 8

8-bit memory width strikes a balance between speed and storage capacity, ideal for many applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with most PCB designs and simplifies manufacturing.

No. of Words Code: 128K

Rich word code capacity enables the support of complex applications and data storage requirements.

Command User Interface: YES

User-friendly command interface allows for easier integration and control in various applications.

Maximum Supply Voltage (Vsup): 5.5V

Allows for a higher operating voltage margin, ensuring better stability and reliability.

Endurance: 100000 Write/Erase Cycles

High endurance rating makes this flash memory suitable for applications requiring frequent data updates.

Memory Density: 1048576 bit

High memory density offers substantial storage capacity for various data-intensive applications.

Memory IC Type: FLASH

Flash memory type provides non-volatile storage, retaining data even when powered off.

Maximum Standby Current: 0.0001 Amp

Ultra-low standby current enhances energy efficiency in low-power applications.

Maximum Access Time: 70 ns

Fast access time improves overall system performance, making it suitable for high-speed applications.

Data Polling: YES

Data polling capability allows for real-time monitoring of memory status, ensuring better data management.

Technical Specifications

Flash Memory M29F010B70K6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

16K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M29F010B70K6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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