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M27C801-55K1

STMicroelectronics

M27C801-55K1 by STMicroelectronics

M27C801-55K1 by STMicroelectronics is a 1M x 8-bit OTP ROM with a max access time of 55 ns, ideal for fast data retrieval. It operates asynchronously at a nominal voltage of 5V and features a compact chip carrier package. This versatile memory solution suits various commercial applications requiring reliable storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,264 parts In-Stock

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7,264

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Digiode

USA . 1,437 parts In-Stock

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1,437

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Anansix

USA . 1,107 parts In-Stock

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1,107

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 990 parts In-Stock

1+ parts

$3.640

100+ parts

-

1k+ parts

$3.276

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990

$3.640

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$3.276

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MKK Technologies

India . 928 parts In-Stock

1+ parts

$6.844

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928

$6.844

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DigiPath Technology Company

USA . 928 parts In-Stock

1+ parts

$6.844

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928

$6.844

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AZTECH Wire

Italy . 66 parts In-Stock

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$18.740

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66

$18.740

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,194 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,217 parts In-Stock

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Microchip USA

USA . 5,507 parts In-Stock

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5,507

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Alle Elektronik GmbH

Germany . 4,811 parts In-Stock

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Corphita

USA . 3,938 parts In-Stock

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Metaverse IC Inc.

Canada . 1,918 parts In-Stock

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Parana Technologies

USA . 1,650 parts In-Stock

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$4.352

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$4.352

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Overview

Unlock unparalleled reliability and performance with the M27C801-55K1 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality OTP ROM delivers exceptional value across diverse applications, from consumer electronics to industrial devices. With its efficient design and robust temperature range, it ensures seamless operation, empowering your products to stand out in a competitive market while maximizing longevity and efficiency. Experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for easy integration into compact circuit designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB while allowing efficient thermal management.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables fast access times and simplifies system design by reducing timing constraints.

Input/Output Type: COMMON

Having a common input/output type enhances compatibility with a variety of electronic systems, making it versatile.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V offers compatibility with standard digital circuits and systems.

Power Supplies (V): 5

Operating at 5V ensures low power consumption, which is advantageous for battery-operated applications.

No. of Terminals: 32

A total of 32 terminals provides ample connectivity options for versatile integration into various designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style enables straightforward mounting on circuit boards and enhances signal integrity.

Maximum Operating Temperature: 70 °C

Operating comfortably at a maximum temperature of 70 °C makes it suitable for commercial applications.

Organization: 1MX8

This organization allows for efficient data storage and retrieval, making read and write operations faster.

Output Characteristics: 3-STATE

With 3-state output characteristics, the product can interface with multiple devices without conflicts.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for use in a wide range of environmental conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and resistance to corrosion, enhancing the reliability of connections.

Terminal Position: QUAD

The quad terminal positioning facilitates easier access and routing of signals on the PCB.

Maximum Seated Height: 3.56 mm

A compact maximum seated height enables integration into low-profile devices, catering to space-constrained designs.

Width: 11.43 mm

A modest width of 11.43 mm makes it suitable for a variety of applications without sacrificing performance.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, it assures consistent performance in various power supply conditions.

Length: 13.97 mm

The length of 13.97 mm allows for efficient layout on PCBs, making it ideal for compact designs.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, this product can be used in a wide variety of consumer electronics.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, essential for modern electronic devices.

Parallel or Serial: PARALLEL

Parallel data handling enables faster data transfer rates, making it ideal for high-performance applications.

Terminal Form: J BEND

J-bend terminal form provides a secure connection and simplifies the mounting process.

Maximum Supply Current: 35 mA

A maximum supply current of 35 mA allows for efficient power usage, making it suitable for battery-powered devices.

No. of Words: 1048576 words

With 1M words, this OTP ROM offers significant storage capacity for applications requiring substantial data.

Memory Width: 8

An 8-bit memory width ensures compatibility with most microcontrollers and facilitates efficient data processing.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for higher density layouts while maintaining reliability in connections.

No. of Words Code: 1M

The capability to store 1M words ensures sufficient memory space for more complex applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides flexibility for power supply design and integration.

Memory Density: 8388608 bit

High memory density of 8388608 bits makes it suitable for applications that demand significant memory resources.

Memory IC Type: OTP ROM

As an OTP ROM, it provides a cost-effective solution for applications requiring permanent storage of data.

Maximum Standby Current: 0.0001 Amp

With a maximum standby current of only 0.0001 Amps, the product is energy-efficient, extending battery life in portable applications.

Maximum Access Time: 55 ns

A maximum access time of 55 ns enables fast data retrieval, making it suitable for performance-critical applications.

Technical Specifications

OTP ROM M27C801-55K1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27C801-55K1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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