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M27C256B-90B6

STMicroelectronics

M27C256B-90B6 by STMicroelectronics

STMicroelectronics M27C256B-90B6 is a 32KX8 OTP ROM with 3-STATE output, operating at 5V. It has a max access time of 90ns and is ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.

Median Price

$10.220

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 20 parts In-Stock

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Sternenhof Electronics

Switzerland . 5,629 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Bristol Electronics

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ComSIT Distribution GmbH

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ComSIT USA

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Atlantic Semiconductor

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Lantek

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Euro-Tech

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ACDS - Activité Composants Distribution Service

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EPE Components Inc.

USA . 19 parts In-Stock

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Sunrise Surplus Inc.

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Prism Electronics

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R&J Components

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Cyclops Electronics Ltd

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Distributors (Availability)

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Component Stockers USA

USA . 2,915 parts In-Stock

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$2.350

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$2.230

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$2.160

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

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$3.756

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MKK Technologies

India . 864 parts In-Stock

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$7.064

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DigiPath Technology Company

USA . 864 parts In-Stock

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AZTECH Wire

Italy . 615 parts In-Stock

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$12.880

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RC Electronics

USA . 66,913 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 16,000 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Microchip USA

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Corphita

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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Assy Fe

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Parana Technologies

USA . 1,023 parts In-Stock

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Perfect Parts

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Eliminating Global Boundries, Inc

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GreenTree Electronics

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Akira Global LLC

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Overview

Experience the unparalleled quality and reliability of the M27C256B-90B6 by STMicroelectronics, a leading manufacturer in the industry. This OTP ROM memory device offers exceptional value and benefits for various applications, providing customers with a secure and efficient solution for their storage needs. With its advanced technology and industrial-grade design, the M27C256B-90B6 ensures optimal performance and longevity, making it the ideal choice for your next project. Unlock the potential of your applications with this high-quality product from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting and reliable.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without the need for synchronization, offering flexibility in use.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements, ensuring ease of integration with existing systems.

Output Characteristics: 3-STATE

Enables multiple outputs to be in an off-state, reducing power consumption and enhancing efficiency.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, leading to energy-efficient operation.

Technical Specifications

OTP ROM M27C256B-90B6 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

36.83 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.75

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C256B-90B6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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