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LSM330TR

STMicroelectronics

LSM330TR by STMicroelectronics

LSM330TR by STMicroelectronics is a 24-terminal IC with 3V supply voltage, suitable for industrial applications. It features a rectangular package shape, CMOS technology, and operates b/w -40 to 85°C. Ideal for analog circuits, it has a thin profile of 1.027mm and supports surface mount installation.

Median Price

$2.529

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 99 parts In-Stock

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$2.529

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99

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Chip Stock

USA . 8,000 parts In-Stock

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Vyrian

USA . 4,030 parts In-Stock

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Digiode

USA . 3,547 parts In-Stock

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Anansix

USA . 1,263 parts In-Stock

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Prism Electronics

USA . 113 parts In-Stock

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Component Stockers USA

USA . 1 parts In-Stock

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$2.010

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1

$2.010

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Aranea Global

USA . 1,000 parts In-Stock

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$2.478

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$2.379

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1,000

$2.478

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$2.379

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Ampacity Inc.

Singapore . 806 parts In-Stock

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$2.500

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806

$2.500

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Corohmni

South Africa . 107 parts In-Stock

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$5.048

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AZTECH Wire

Italy . 381 parts In-Stock

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$8.651

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Aztec Data Supply Inc.

USA . 2,498 parts In-Stock

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$9.570

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IDEA Electronic Components Group

UK . 856 parts In-Stock

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$18.746

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$16.871

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$18.746

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MKK Technologies

India . 1,228 parts In-Stock

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$35.250

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DigiPath Technology Company

USA . 1,228 parts In-Stock

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$35.250

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Lixinc

USA . 10,285 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,558 parts In-Stock

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Parana Technologies

USA . 2,125 parts In-Stock

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$22.414

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Perfect Parts

USA . 1,987 parts In-Stock

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Argo Parts USA

USA . 1,902 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,400 parts In-Stock

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Corphita

USA . 1,197 parts In-Stock

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Kepictronics

USA . 999 parts In-Stock

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Continental Prestige Electronics

USA . 290 parts In-Stock

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Overview

Elevate your projects with the LSM330TR by STMicroelectronics, a high-quality semiconductor that promises exceptional performance and reliability. Manufactured by industry leader STMicroelectronics, this sensor offers a wide range of applications in various industries. Its advanced technology, compact design, and industrial-grade temperature grade make it a versatile solution for your needs. Experience unmatched value, precision, and efficiency with the LSM330TR, setting you ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the semiconductor, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the semiconductor onto circuit boards, saving time and resources during assembly.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of systems and applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style enables high-density mounting of the semiconductor, optimizing space utilization on the circuit board.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this semiconductor can perform reliably in a variety of environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this semiconductor suitable for use in cold environments or industrial applications that require robust performance.

Technology: CMOS

The CMOS technology used in this semiconductor offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Other Function Semiconductors LSM330TR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.12X.14,17

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.027 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.43 mm

Terminal Position:

BOTTOM

Width (mm):

3 mm

Trade Compliance

LSM330TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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