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LSM303AGR

STMicroelectronics

LSM303AGR by STMicroelectronics

LSM303AGR by STMicroelectronics is a 12-terminal IC with Vsup ranging from 1.71V to 3.6V, operating b/w -40°C to 85°C. It features a very thin profile and fine pitch package style for industrial applications requiring precise analog circuit functionality in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 19,695 parts In-Stock

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19,695

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Sensible Micro Corp

USA . 18,966 parts In-Stock

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18,966

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Digiode

USA . 4,648 parts In-Stock

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4,648

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Anansix

USA . 2,708 parts In-Stock

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2,708

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Vyrian

USA . 1,200 parts In-Stock

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1,200

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,181 parts In-Stock

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$1.500

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-

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1,181

$1.500

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Semicontronic

India . 280 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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280

$4.500

$4.388

$4.365

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$6.524

100+ parts

$6.198

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$6.198

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-

2,500

$6.524

$6.198

$6.198

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IDEA Electronic Components Group

UK . 129 parts In-Stock

1+ parts

$8.692

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-

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$7.823

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129

$8.692

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$7.823

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Corohmni

South Africa . 123 parts In-Stock

1+ parts

$12.665

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123

$12.665

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AZTECH Wire

Italy . 225 parts In-Stock

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$15.732

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225

$15.732

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MKK Technologies

India . 1,771 parts In-Stock

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$16.345

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1,771

$16.345

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DigiPath Technology Company

USA . 1,771 parts In-Stock

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$16.345

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1,771

$16.345

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Aztec Data Supply Inc.

USA . 1,774 parts In-Stock

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$22.089

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1,774

$22.089

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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RC Electronics

USA . 4,500 parts In-Stock

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$4.360

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$4.110

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$4.030

4,500

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$4.360

$4.110

$4.030

Continental Prestige Electronics

USA . 2,275 parts In-Stock

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2,275

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Parana Technologies

USA . 1,556 parts In-Stock

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$10.393

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1,556

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$10.393

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Corphita

USA . 1,312 parts In-Stock

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1,312

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Lixinc

USA . 463 parts In-Stock

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463

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Argo Parts USA

USA . 159 parts In-Stock

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159

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Experience the innovation and quality of STMicroelectronics with the LSM303AGR, a cutting-edge Other Function Semiconductor that offers unparalleled performance and reliability. This versatile sensor opens up a world of possibilities in various applications, providing precise and accurate data for your projects. With its advanced features and superior technology, the LSM303AGR delivers exceptional value and benefits to customers seeking high-quality solutions for their electronic needs. Trust STMicroelectronics to take your products to the next level with the LSM303AGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving design in electronic circuits.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy integration into circuit designs.

Nominal Supply Voltage (Vsup): 2.5 V

The stable supply voltage ensures consistent performance and reliable operation of the product.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options in circuits, providing flexibility in design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array design with a thin profile and fine pitch enables high-density mounting and efficient signal routing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance in various environments and applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance of the product in circuit designs.

Maximum Seated Height: 1 mm

The low seated height helps in maintaining a compact overall circuit design and saves space.

Width (mm): 2 mm

The small width allows for efficient utilization of space and integration into tight layouts.

Other IC type: ANALOG CIRCUIT

Being an analog circuit, this product is suitable for applications requiring accurate signal processing and control.

Minimum Supply Voltage (Vsup): 1.71 V

The low minimum supply voltage allows for energy-efficient operation and compatibility with low-power applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without damage.

Length: 2 mm

The compact length contributes to a space-saving design and enables integration into small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Terminal Form: BUTT

The butt terminal form provides a secure connection and ease of soldering during assembly.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and precise connection in complex circuit layouts.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage expands the product's compatibility with a wide range of power sources and applications.

Technical Specifications

Other Function Semiconductors LSM303AGR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B12

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

2 mm

Trade Compliance

LSM303AGR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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