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LSM330DLC

STMicroelectronics

LSM330DLC by STMicroelectronics

LSM330DLC by STMicroelectronics is a 28-terminal IC with a supply voltage range of 2.4V to 3.6V, operating b/w -40°C to 85°C. This rectangular package features a CMOS technology and is suitable for industrial applications requiring precise motion sensing capabilities in compact designs.

Median Price

$4.150

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$4.150

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-

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900

$4.150

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Vyrian

USA . 7,800 parts In-Stock

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7,800

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Chip Stock

USA . 5,841 parts In-Stock

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5,841

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ComSIT Distribution GmbH

Germany . 3,525 parts In-Stock

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3,525

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Digiode

USA . 3,377 parts In-Stock

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3,377

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Anansix

USA . 2,123 parts In-Stock

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2,123

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Bristol Electronics

USA . 28 parts In-Stock

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28

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Flex Direct, LLC

USA . 28 parts In-Stock

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28

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PC Components Company LLC

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Semicontronic

India . 1,634 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,634

$0.500

$0.488

$0.485

-

Benley Electronics

USA . 5 parts In-Stock

1+ parts

$1.750

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-

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5

$1.750

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$3.509

100+ parts

-

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$3.158

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1,406

$3.509

-

$3.158

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Continental Prestige Electronics

USA . 5,359 parts In-Stock

1+ parts

$4.150

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$4.067

5,359

$4.150

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$4.067

Argo Parts USA

USA . 4,991 parts In-Stock

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$4.150

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4,991

$4.150

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.150

100+ parts

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$3.943

10k+ parts

$3.860

1,000

$4.150

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$3.943

$3.860

MKK Technologies

India . 1,192 parts In-Stock

1+ parts

$6.598

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$6.598

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DigiPath Technology Company

USA . 1,192 parts In-Stock

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$6.598

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$6.598

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$7.500

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1,420

$7.500

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AZTECH Wire

Italy . 516 parts In-Stock

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$9.849

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516

$9.849

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Perfect Parts

USA . 24,805 parts In-Stock

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Lixinc

USA . 8,527 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,126 parts In-Stock

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RC Electronics

USA . 5,770 parts In-Stock

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5,770

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Corphita

USA . 4,948 parts In-Stock

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4,948

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Alle Elektronik GmbH

Germany . 4,084 parts In-Stock

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4,084

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Parana Technologies

USA . 1,307 parts In-Stock

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$4.195

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1,307

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$4.195

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GreenTree Electronics

Israel . 980 parts In-Stock

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980

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Kepictronics

USA . 80 parts In-Stock

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80

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Assy Fe

Spain . 4 parts In-Stock

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4

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Overview

Discover the LSM330DLC by STMicroelectronics, a top-of-the-line product in the category of Other Function Semiconductors. With its superior quality and innovative design, this surface mount device offers endless possibilities for your projects. Whether you're a tech enthusiast or a professional engineer, this versatile component provides reliable performance and precise results. Say goodbye to limitations and hello to limitless potential with the LSM330DLC.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient automated assembly, making this product suitable for mass production.

Nominal Supply Voltage (Vsup): 3 V

Optimal supply voltage for this product ensures stable and reliable performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in various industrial environments without risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Maximum Supply Voltage (Vsup): 3.6 V

Allows for a higher supply voltage range, providing flexibility in design and compatibility with multiple systems.

Technical Specifications

Other Function Semiconductors LSM330DLC attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16X.2,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LSM330DLC Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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