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LSM303DLM

STMicroelectronics

LSM303DLM by STMicroelectronics

LSM303DLM by STMicroelectronics is a square-shaped, surface-mountable sensor with a 2.5V nominal voltage. It operates in industrial temperature range (-40 to 85°C) and is commonly used for analog circuit applications.

Median Price

$4.925

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$4.925

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Vyrian

USA . 6,190 parts In-Stock

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Digiode

USA . 4,445 parts In-Stock

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Anansix

USA . 2,077 parts In-Stock

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Bristol Electronics

USA . 333 parts In-Stock

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Atlantic Semiconductor

USA . 333 parts In-Stock

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ComSIT Distribution GmbH

Germany . 93 parts In-Stock

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ComSIT USA

USA . 93 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 602 parts In-Stock

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$0.500

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602

$0.500

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

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$3.188

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$2.869

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$2.869

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Semicontronic

India . 1,035 parts In-Stock

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$3.500

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$3.412

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$3.395

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1,035

$3.500

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Continental Prestige Electronics

USA . 1,500 parts In-Stock

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$4.925

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$4.827

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$4.925

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$4.827

Advanced Electronics

New Zealand . 350 parts In-Stock

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$5.225

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$4.964

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$4.964

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350

$5.225

$4.964

$4.964

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MKK Technologies

India . 2,370 parts In-Stock

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$5.994

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2,370

$5.994

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DigiPath Technology Company

USA . 2,370 parts In-Stock

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$5.994

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Corohmni

South Africa . 149 parts In-Stock

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$7.903

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Aztec Data Supply Inc.

USA . 339 parts In-Stock

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$9.800

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339

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AZTECH Wire

Italy . 756 parts In-Stock

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$17.413

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756

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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Lixinc

USA . 8,763 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,529 parts In-Stock

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Argo Parts USA

USA . 3,870 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,686 parts In-Stock

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3,686

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Parana Technologies

USA . 1,925 parts In-Stock

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$3.812

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$3.812

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Corphita

USA . 1,640 parts In-Stock

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GreenTree Electronics

Israel . 1,601 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$4.827

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$4.679

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$4.580

500

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$4.827

$4.679

$4.580

Cyclops Electronics Ltd (Excess)

UK . 70 parts In-Stock

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Glotronic Ltd.

UK . 56 parts In-Stock

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Overview

Discover the revolutionary LSM303DLM by STMicroelectronics, a high-quality semiconductor that is taking the industry by storm. With its advanced technology and reliable performance, this product is manufactured by one of the leading names in the field, ensuring unmatched precision and durability. Designed for a wide range of applications, the LSM303DLM offers unparalleled value to customers. Whether you're looking to enhance your navigation systems, improve motion sensing capabilities, or revolutionize your IoT devices, this product delivers exceptional accuracy and efficiency. Don't settle for anything less than the best - choose the LSM303DLM and experience the advantages of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and resistance to environmental factors, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and soldering on printed circuit boards, offering convenience and flexibility in the manufacturing process.

No. of Functions: 1

This product offers a single function, simplifying design and integration into electronic systems, making it an efficient choice for specific applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on printed circuit boards, enabling compact designs and maximizing layout possibilities.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5V nominal supply voltage ensures low power consumption and compatibility with a wide range of electronic systems, making it suitable for battery-powered devices.

Power Supplies (V): 2.5

This product operates with a standard 2.5V power supply, ensuring compatibility with many electronic systems and simplifying integration.

No. of Terminals: 28

With 28 terminals, this product offers ample connection options, allowing for versatile usage in complex circuitry and increasing design flexibility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch allows for high-density mounting, efficient use of board space, and excellent electrical performance, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C ensures reliable performance even in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions, enhancing its reliability and suitability for various environments.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity, corrosion resistance, and reliability, ensuring long-term performance and durability of the product.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and efficient PCB layout, allowing for smooth integration into electronic systems and optimizing signal routing.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this product allows for compact and low-profile designs, enhancing the aesthetics and space efficiency of electronic devices.

Width (mm): 5 mm

The compact width of 5mm enables space-saving arrangements on circuit boards, promoting efficient design layouts and enabling miniaturization of electronic systems.

Other IC type: ANALOG CIRCUIT

This product belongs to the category of analog circuit integrated circuits, providing accurate and reliable signal processing, making it a suitable choice for various analog applications.

Minimum Supply Voltage (Vsup): 2.16 V

The minimum supply voltage requirement of 2.16V ensures operation even in low-power scenarios, expanding the range of compatible systems and enabling energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a maximum of 30 seconds at peak reflow temperature, allowing for efficient soldering during assembly and reducing manufacturing time.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can endure high-temperature soldering processes, ensuring reliable connections and robust performance.

Length: 5 mm

The compact length of 5mm enables space-efficient placement on circuit boards, contributing to compact device designs and optimizing layout possibilities.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature grade standards, this product ensures reliable performance and durability in harsh operating conditions, making it suitable for demanding applications.

Technology: CMOS

Based on complementary metal-oxide-semiconductor (CMOS) technology, this product offers low power consumption, high speed, and noise immunity, making it an excellent choice for various digital and analog applications.

Terminal Form: BUTT

The butt terminal form simplifies the soldering process and ensures secure connections, enhancing the product's reliability in demanding environments.

Terminal Pitch: 0.55 mm

With a terminal pitch of 0.55mm, this product offers high-density interconnectivity, enabling space-efficient designs and enhancing the versatility of electronic systems.

Moisture Sensitivity Level (MSL): 3

Rated as moisture sensitivity level 3, this product provides adequate protection against moisture during handling and assembly, ensuring prolonged shelf life and reducing the risk of moisture-induced failures.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows for compatibility with a wide range of systems and power sources, making it suitable for various electronic applications.

Technical Specifications

Other Function Semiconductors LSM303DLM attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,22

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.55 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

LSM303DLM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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