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LSM303C

STMicroelectronics

LSM303C by STMicroelectronics

LSM303C by STMicroelectronics is a 12-terminal IC with a supply voltage range of 1.9V to 3.6V, operating b/w -40°C to 85°C. It features a very thin profile, fine pitch package style suitable for industrial applications requiring precise analog circuit functions in compact spaces. LSM303C is designed for surface mount assembly and offers high reliability with nickel gold terminal finish.

Median Price

$1.367

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$1.367

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$1.367

-

-

-

Digiode

USA . 1,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,881

-

-

-

-

Anansix

USA . 1,381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,381

-

-

-

-

Vyrian

USA . 1,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,263

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,283 parts In-Stock

1+ parts

$1.367

100+ parts

-

1k+ parts

-

10k+ parts

-

3,283

$1.367

-

-

-

Continental Prestige Electronics

USA . 3,045 parts In-Stock

1+ parts

$1.367

100+ parts

-

1k+ parts

-

10k+ parts

$1.340

3,045

$1.367

-

-

$1.340

Semicontronic

India . 1,246 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,246

$5.500

$5.362

$5.335

-

Ampacity Inc.

Singapore . 1,025 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$7.500

-

-

-

Aztec Data Supply Inc.

USA . 4,640 parts In-Stock

1+ parts

$10.040

100+ parts

-

1k+ parts

-

10k+ parts

-

4,640

$10.040

-

-

-

AZTECH Wire

Italy . 678 parts In-Stock

1+ parts

$10.144

100+ parts

-

1k+ parts

-

10k+ parts

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678

$10.144

-

-

-

Corohmni

South Africa . 76 parts In-Stock

1+ parts

$18.747

100+ parts

-

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-

10k+ parts

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76

$18.747

-

-

-

IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$22.127

100+ parts

-

1k+ parts

$19.914

10k+ parts

-

1,500

$22.127

-

$19.914

-

MKK Technologies

India . 2,183 parts In-Stock

1+ parts

$41.608

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$41.608

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-

-

DigiPath Technology Company

USA . 2,183 parts In-Stock

1+ parts

$41.608

100+ parts

-

1k+ parts

-

10k+ parts

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2,183

$41.608

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-

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Lixinc

USA . 14,118 parts In-Stock

1+ parts

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100+ parts

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14,118

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-

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Parana Technologies

USA . 2,340 parts In-Stock

1+ parts

-

100+ parts

$26.456

1k+ parts

-

10k+ parts

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2,340

-

$26.456

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-

Corphita

USA . 1,485 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,485

-

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.340

1k+ parts

$1.299

10k+ parts

$1.271

50

-

$1.340

$1.299

$1.271

Overview

Discover the power of the LSM303C by STMicroelectronics, a top-quality semiconductor that offers unmatched performance and reliability. With its innovative design and advanced technology, this product is perfect for a wide range of applications. STMicroelectronics, a renowned manufacturer in the industry, ensures that each component meets the highest standards of quality. Customers can trust in the value and benefits that the LSM303C provides, making it an essential choice for any project. Experience the advantages of this cutting-edge product and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ensuring reliable performance.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a nominal supply voltage of 2.5V provides compatibility with a wide range of systems and power sources.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch allows for high-density mounting and improved signal integrity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable functionality in extreme cold conditions.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Width (mm): 2 mm

With a compact width of 2mm, this product is suitable for applications where space is limited.

Other IC type: ANALOG CIRCUIT

Featuring analog circuitry, this product is ideal for applications requiring precise signal processing and voltage regulation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures robust solder connections during assembly processes, contributing to the product's reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the stringent performance and durability requirements of industrial environments.

Terminal Form: BUTT

The butt terminal form facilitates easy and reliable connection to external components, simplifying installation and maintenance.

Technical Specifications

Other Function Semiconductors LSM303C attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B12

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.9 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

LSM303C Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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