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LSM303DTR

STMicroelectronics

LSM303DTR by STMicroelectronics

LSM303DTR by STMicroelectronics is a 16-terminal IC with a supply voltage range of 2.16V to 3.6V, operating b/w -40°C to 85°C. Its package style is grid array with very thin profile and fine pitch, suitable for industrial applications requiring precise analog circuit functions in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Chip Stock

USA . 25,233 parts In-Stock

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Vyrian

USA . 3,147 parts In-Stock

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Anansix

USA . 2,843 parts In-Stock

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2,843

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Digiode

USA . 1,829 parts In-Stock

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Bristol Electronics

USA . 245 parts In-Stock

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245

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Nova Conductors

Japan . 50 parts In-Stock

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50

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LIBRA Elektronik GmbH

Germany . 41 parts In-Stock

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41

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Inventory MP

USA . 18 parts In-Stock

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18

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Cyclops Electronics Ltd

UK . 8 parts In-Stock

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8

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Prism Electronics

USA . 3 parts In-Stock

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3

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Rebound Electronics

UK . 1 parts In-Stock

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1

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NAC Semi

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Benley Electronics

USA . 2 parts In-Stock

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$2.000

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-

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2

$2.000

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Aztec Data Supply Inc.

USA . 3,197 parts In-Stock

1+ parts

$4.380

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3,197

$4.380

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

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$5.500

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1,627

$5.500

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Semicontronic

India . 1,601 parts In-Stock

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$7.500

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$7.312

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$7.275

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1,601

$7.500

$7.312

$7.275

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$12.021

100+ parts

$10.939

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$9.857

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450

$12.021

$10.939

$9.857

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AZTECH Wire

Italy . 858 parts In-Stock

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$13.252

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858

$13.252

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Corohmni

South Africa . 916 parts In-Stock

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$15.421

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916

$15.421

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IDEA Electronic Components Group

UK . 824 parts In-Stock

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$20.516

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$18.464

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824

$20.516

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$18.464

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MKK Technologies

India . 995 parts In-Stock

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$38.579

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995

$38.579

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DigiPath Technology Company

USA . 995 parts In-Stock

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$38.579

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995

$38.579

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Assy Fe

Spain . 37,992 parts In-Stock

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Kepictronics

USA . 28,000 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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RC Electronics

USA . 8,407 parts In-Stock

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Continental Prestige Electronics

USA . 6,259 parts In-Stock

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Lixinc

USA . 4,565 parts In-Stock

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Corphita

USA . 4,215 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,128 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,483 parts In-Stock

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2,483

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,815 parts In-Stock

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$24.530

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1,815

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$24.530

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Argo Parts USA

USA . 725 parts In-Stock

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725

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Lucentia Tech

USA . 250 parts In-Stock

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$0.061

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$0.061

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$0.061

250

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$0.061

$0.061

$0.061

Bastille Electronics

Australia . 16 parts In-Stock

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16

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Overview

Unleash the power of innovation with the LSM303DTR by STMicroelectronics. As a leading manufacturer in the semiconductor industry, STMicroelectronics brings you a cutting-edge solution for a wide range of applications. With its high-quality construction and advanced technology, this product offers unparalleled value and benefits to customers. Experience superior performance and reliability with the LSM303DTR, making it the ideal choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy is a durable material that provides good protection for the semiconductor components inside.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5V supply voltage is commonly used in many electronic devices, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures that this product can function in cold environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Width (mm): 3 mm

The compact 3mm width allows for efficient use of PCB space, especially in applications with limited board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can operate reliably in harsh industrial environments.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this product is less sensitive to moisture during handling and assembly processes.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage allows for flexibility in power supply options, accommodating various voltage requirements.

Technical Specifications

Other Function Semiconductors LSM303DTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-BU16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

3 mm

Trade Compliance

LSM303DTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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