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LSM303DLHTR

STMicroelectronics

LSM303DLHTR by STMicroelectronics

LSM303DLHTR by STMicroelectronics is a 28-terminal IC with 2.5V nominal voltage, suitable for analog circuits. It operates b/w -30°C to 85°C, with a peak reflow temperature of 260°C and MSL level of 3. The square-shaped package is made of plastic/epoxy and supports surface mount technology, ideal for various applications requiring precise motion sensing capabilities.

Median Price

$5.215

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,011 parts In-Stock

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$4.900

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1,011

$4.900

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Chip1Stop

Japan . 1,464 parts In-Stock

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$5.530

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1,464

$5.530

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Verical

USA . 1,011 parts In-Stock

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1,011

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Distributors (In-Stock)

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Digiode

USA . 2,576 parts In-Stock

1+ parts

$4.586

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2,576

$4.586

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Nova Conductors

Japan . 300 parts In-Stock

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$5.617

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300

$5.617

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Component Electronics Inc.

Canada . 10 parts In-Stock

1+ parts

$9.230

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$6.920

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$6.000

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-

10

$9.230

$6.920

$6.000

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Vyrian

USA . 5,410 parts In-Stock

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5,410

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PC Components Company LLC

USA . 3,468 parts In-Stock

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3,468

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Anansix

USA . 1,371 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 596 parts In-Stock

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596

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Bristol Electronics

USA . 596 parts In-Stock

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Dan-Mar Components

USA . 596 parts In-Stock

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Cyclops Electronics Ltd

UK . 177 parts In-Stock

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A&K Electronics

USA . 107 parts In-Stock

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Rotakorn

Sweden . 107 parts In-Stock

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107

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Semtec, LLC

USA . 52 parts In-Stock

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52

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LIBRA Elektronik GmbH

Germany . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5 parts In-Stock

1+ parts

$1.302

100+ parts

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5

$1.302

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Ampacity Inc.

Singapore . 1,071 parts In-Stock

1+ parts

$4.100

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1,071

$4.100

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Corphita

USA . 703 parts In-Stock

1+ parts

$4.344

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703

$4.344

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Continental Prestige Electronics

USA . 2,594 parts In-Stock

1+ parts

$5.617

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$5.504

2,594

$5.617

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$5.504

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.617

100+ parts

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$5.336

10k+ parts

$5.223

2,000

$5.617

-

$5.336

$5.223

IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$6.233

100+ parts

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$5.610

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1,753

$6.233

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$5.610

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Aztec Data Supply Inc.

USA . 736 parts In-Stock

1+ parts

$7.270

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736

$7.270

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MKK Technologies

India . 515 parts In-Stock

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$11.721

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515

$11.721

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DigiPath Technology Company

USA . 515 parts In-Stock

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$11.721

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515

$11.721

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AZTECH Wire

Italy . 1,136 parts In-Stock

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$12.450

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$12.450

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 13,716 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Assy Fe

Spain . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,717 parts In-Stock

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4,717

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A-Z Elektronik GmbH

Germany . 2,069 parts In-Stock

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2,069

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Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

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$7.452

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1,609

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$7.452

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Alle Elektronik GmbH

Germany . 1,379 parts In-Stock

1+ parts

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1,379

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ChipstoGo Electronic ltd

UK . 281 parts In-Stock

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281

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Overview

Experience the next level of precision and reliability with the LSM303DLHTR by STMicroelectronics. Crafted with cutting-edge technology and superior quality materials, this advanced semiconductor offers a wide range of applications in various industries. From automotive to aerospace, this product is designed to deliver unparalleled performance and accuracy in every use. Trust in STMicroelectronics to provide you with the best-in-class solutions for all your semiconductor needs. Elevate your projects with the LSM303DLHTR and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers high durability and resistance to external elements, ensuring long-term reliability.

Surface Mount: YES

Easily mounted on circuit boards, saving time and space during assembly.

Nominal Supply Voltage (Vsup): 2.5 V

Efficiently operates at a low voltage, reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for various industrial applications.

Technology: CMOS

Utilizes low power consumption and provides high noise immunity, ensuring reliable performance.

Technical Specifications

Other Function Semiconductors LSM303DLHTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,22

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.55 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

LSM303DLHTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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