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LSM303DLHCTR

STMicroelectronics

LSM303DLHCTR by STMicroelectronics

STMicroelectronics LSM303DLHCTR is a CMOS analog circuit with 14 terminals and a supply voltage range of 2.16V to 3.6V. It operates in industrial temperatures from -40°C to 85°C, featuring a very thin profile grid array package suitable for surface mount applications. The sensor's nickel palladium gold finish and rectangular shape make it ideal for precise orientation tracking in various electronic devices.

Median Price

$10.647

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$4.620

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$3.460

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$3.000

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1

$4.620

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USA . 6,550 parts In-Stock

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Vyrian

USA . 6,302 parts In-Stock

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Digiode

USA . 2,577 parts In-Stock

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Anansix

USA . 703 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Prism Electronics

USA . 13 parts In-Stock

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J2 Sourcing AB

Sweden . 4 parts In-Stock

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Component Sense

UK . 3 parts In-Stock

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$16.674

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$16.674

Distributors (Availability)

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Semicontronic

India . 1,260 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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1,260

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,363 parts In-Stock

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$4.500

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$4.500

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IDEA Electronic Components Group

UK . 2,341 parts In-Stock

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$4.903

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$4.412

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2,341

$4.903

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$4.412

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MKK Technologies

India . 1,145 parts In-Stock

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$9.219

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1,145

$9.219

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DigiPath Technology Company

USA . 1,145 parts In-Stock

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$9.219

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$9.219

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AZTECH Wire

Italy . 831 parts In-Stock

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$13.995

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831

$13.995

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Aztec Data Supply Inc.

USA . 1,174 parts In-Stock

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$19.250

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$19.250

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Corohmni

South Africa . 261 parts In-Stock

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$22.339

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261

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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Perfect Parts

USA . 16,022 parts In-Stock

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Lixinc

USA . 13,987 parts In-Stock

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Kepictronics

USA . 5,585 parts In-Stock

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Argo Parts USA

USA . 4,180 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,435 parts In-Stock

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Futuretech Components

Singapore . 3,324 parts In-Stock

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Benley Electronics

USA . 2,908 parts In-Stock

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Parana Technologies

USA . 2,076 parts In-Stock

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$5.862

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Continental Prestige Electronics

USA . 1,758 parts In-Stock

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Corphita

USA . 1,743 parts In-Stock

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RC Electronics

USA . 873 parts In-Stock

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A-Z Elektronik GmbH

Germany . 609 parts In-Stock

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609

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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$0.156

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$0.156

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$0.156

Bastille Electronics

Australia . 300 parts In-Stock

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GreenTree Electronics

Israel . 200 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 4 parts In-Stock

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Overview

Accelerate your project with the LSM303DLHCTR from STMicroelectronics. This top-quality sensor offers unparalleled precision and reliability, perfect for a wide range of applications in the semiconductor industry. With its advanced technology and industrial-grade design, this sensor ensures accurate results even in challenging environments. Say goodbye to compromises and experience the value and benefits that only STMicroelectronics can provide. Elevate your projects with the LSM303DLHCTR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material provides durability and protection for the semiconductor components, making it a reliable choice.

Surface Mount: YES

With surface mount capability, this semiconductor can be easily integrated onto a PCB, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and routing on a circuit board, optimizing space utilization.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a nominal supply voltage of 2.5V ensures compatibility with a wide range of applications and power sources.

No. of Terminals: 14

Having 14 terminals provides the flexibility to connect to various external devices and peripherals, expanding the potential uses of this semiconductor.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch design enables high-density mounting and improved signal integrity.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this semiconductor can perform reliably in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures consistent performance even in harsh industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, making installation and integration more convenient.

Maximum Seated Height: 1 mm

The maximum seated height of 1mm allows for a low-profile design, ideal for space-constrained applications.

Width (mm): 3 mm

With a width of 3mm, this semiconductor is compact and can fit into tight spaces, offering flexibility in circuit design.

Other IC type: ANALOG CIRCUIT

This semiconductor being an analog circuit type enables accurate signal processing and control, making it suitable for a wide range of analog applications.

Minimum Supply Voltage (Vsup): 2.16 V

Operating at a minimum supply voltage of 2.16V ensures energy efficiency and compatibility with low-power systems.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this semiconductor can withstand high-temperature soldering processes without degradation.

Length: 5 mm

The length of 5mm offers a compact form factor, allowing for space-efficient integration into electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this semiconductor can withstand harsh operating conditions and ensure long-term performance and reliability.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BUTT

The butt terminal form simplifies the connection process and ensures secure contact for stable operation.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this semiconductor offers precise and reliable connections for enhanced signal integrity.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this semiconductor requires standard handling and storage precautions to prevent moisture-related issues.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows for compatibility with higher voltage applications, expanding the range of possible uses for this semiconductor.

Technical Specifications

Other Function Semiconductors LSM303DLHCTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-BU14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.12X.2,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

BUTT

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width (mm):

3 mm

Trade Compliance

LSM303DLHCTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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