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TLE5012BDE1200XUMA1

Infineon Technologies

TLE5012BDE1200XUMA1 by Infineon Technologies

TLE5012BDE1200XUMA1 by Infineon is a small outline, thin profile analog circuit IC with 16 terminals. It operates in automotive temperature grades from -40 to 125°C and features a gull wing terminal form with tin finish. This semiconductor is suitable for various applications requiring precise sensing and control in compact spaces.

Median Price

$4.060

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,187 parts In-Stock

1+ parts

$3.438

100+ parts

$3.323

1k+ parts

$3.207

10k+ parts

-

2,187

$3.438

$3.323

$3.207

-

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

$4.110

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$4.110

-

-

-

Newark

USA . 5,825 parts In-Stock

1+ parts

$5.960

100+ parts

$4.520

1k+ parts

$4.270

10k+ parts

-

5,825

$5.960

$4.520

$4.270

-

DigiKey

USA . 4,103 parts In-Stock

1+ parts

$6.080

100+ parts

$4.614

1k+ parts

$4.152

10k+ parts

$3.992

4,103

$6.080

$4.614

$4.152

$3.992

Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$6.080

100+ parts

$4.620

1k+ parts

$4.030

10k+ parts

$3.870

1,000

$6.080

$4.620

$4.030

$3.870

Farnell

UK . 7,490 parts In-Stock

1+ parts

-

100+ parts

$4.010

1k+ parts

$3.500

10k+ parts

$3.010

7,490

-

$4.010

$3.500

$3.010

Element14

Singapore . 7,490 parts In-Stock

1+ parts

-

100+ parts

$6.580

1k+ parts

$6.170

10k+ parts

-

7,490

-

$6.580

$6.170

-

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.543

2,500

-

-

-

$3.543

Verical

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

$3.323

1k+ parts

$3.207

10k+ parts

-

2,187

-

$3.323

$3.207

-

Rochester

USA . 332 parts In-Stock

1+ parts

-

100+ parts

$3.380

1k+ parts

$3.030

10k+ parts

$2.850

332

-

$3.380

$3.030

$2.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 647 parts In-Stock

1+ parts

$4.066

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$4.066

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.335

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$7.335

-

-

-

Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

Vyrian

USA . 5,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,128

-

-

-

-

J2 Sourcing AB

Sweden . 58 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 146 parts In-Stock

1+ parts

$2.793

100+ parts

-

1k+ parts

-

10k+ parts

-

146

$2.793

-

-

-

Semicontronic

India . 4,947 parts In-Stock

1+ parts

$3.210

100+ parts

$3.130

1k+ parts

$3.114

10k+ parts

-

4,947

$3.210

$3.130

$3.114

-

Ampacity Inc.

Singapore . 4,882 parts In-Stock

1+ parts

$3.210

100+ parts

-

1k+ parts

-

10k+ parts

-

4,882

$3.210

-

-

-

Modulus Dynamics

Lithuania . 1,209 parts In-Stock

1+ parts

$3.379

100+ parts

$3.244

1k+ parts

$3.109

10k+ parts

-

1,209

$3.379

$3.244

$3.109

-

Corphita

USA . 420 parts In-Stock

1+ parts

$3.852

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$3.852

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.335

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$7.335

-

-

-

Aztec Data Supply Inc.

USA . 25,052 parts In-Stock

1+ parts

$7.518

100+ parts

-

1k+ parts

-

10k+ parts

-

25,052

$7.518

-

-

-

Component Stockers USA

USA . 15,388 parts In-Stock

1+ parts

$7.610

100+ parts

$4.870

1k+ parts

$4.260

10k+ parts

-

15,388

$7.610

$4.870

$4.260

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$19.536

100+ parts

$18.559

1k+ parts

$18.559

10k+ parts

-

5,000

$19.536

$18.559

$18.559

-

Continental Prestige Electronics

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$6.640

1k+ parts

-

10k+ parts

-

7,500

-

$6.640

-

-

Robosynatics

Brazil . 5,870 parts In-Stock

1+ parts

-

100+ parts

$6.386

1k+ parts

$6.255

10k+ parts

$6.255

5,870

-

$6.386

$6.255

$6.255

Lucentia Tech

USA . 5,870 parts In-Stock

1+ parts

-

100+ parts

$6.386

1k+ parts

$6.255

10k+ parts

$6.255

5,870

-

$6.386

$6.255

$6.255

Argo Parts USA

USA . 509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

509

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock the full potential of your automotive applications with the TLE5012BDE1200XUMA1 by Infineon Technologies. This Analog Circuit semiconductor offers unparalleled quality and reliability, thanks to its advanced CMOS technology and automotive-grade temperature grade. With a compact design and dual terminal position, this small outline, thin profile package provides precise measurements and accurate data processing. Trust in Infineon Technologies to deliver cutting-edge solutions that bring value and efficiency to every project. Elevate your designs with the TLE5012BDE1200XUMA1 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the semiconductor components.

Surface Mount:

YES - Allows for easy installation and space-saving design in circuit boards.

Package Shape:

RECTANGULAR - Facilitates easy placement and alignment on PCBs.

No. of Terminals:

16 - Provides sufficient connectivity options for various circuit configurations.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enables compact and efficient design in electronic devices.

Maximum Operating Temperature:

125 °C - Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

Terminal Finish:

TIN - Offers good conductivity and corrosion resistance for reliable connections.

Terminal Position:

DUAL - Allows for flexibility in circuit layout and connectivity.

Maximum Seated Height:

1.2 mm - Ideal for compact and slim electronic devices.

Width (mm):

3.9 mm - Contributes to the overall small form factor of the product.

Other IC type:

ANALOG CIRCUIT - Provides specific functionality for analog signal processing.

Length:

5 mm - Adds to the compact size of the semiconductor package.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive applications with reliable performance in varying temperature conditions.

Technology:

CMOS - Offers low power consumption and high noise immunity for efficient operation.

Terminal Form:

GULL WING - Facilitates easy soldering onto PCBs.

Terminal Pitch:

0.65 mm - Allows for precise and compact layout of terminals on the package.

Moisture Sensitivity Level (MSL):

3 - Indicates the level of protection against moisture during storage and handling.

Technical Specifications

Other Function Semiconductors TLE5012BDE1200XUMA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TLE5012BDE1200XUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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