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TLE5012BE5020XUMA1

Infineon Technologies

TLE5012BE5020XUMA1 by Infineon Technologies

TLE5012BE5020XUMA1 by Infineon Technologies is a CMOS analog circuit with 8 terminals, operating at 3-5.5V. Its small outline package measures 5x4mm and has a seated height of 1.75mm, suitable for surface mount applications in various electronic systems.

Median Price

$3.450

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 37 parts In-Stock

1+ parts

$2.460

100+ parts

$1.980

1k+ parts

$1.740

10k+ parts

-

37

$2.460

$1.980

$1.740

-

Chip1Stop

Japan . 2,480 parts In-Stock

1+ parts

$3.450

100+ parts

$2.550

1k+ parts

$2.310

10k+ parts

-

2,480

$3.450

$2.550

$2.310

-

Mouser Electronics

USA . 1,969 parts In-Stock

1+ parts

$3.460

100+ parts

$2.580

1k+ parts

$2.290

10k+ parts

$2.190

1,969

$3.460

$2.580

$2.290

$2.190

DigiKey

USA . 4,880 parts In-Stock

1+ parts

$3.630

100+ parts

$2.705

1k+ parts

$2.410

10k+ parts

$2.314

4,880

$3.630

$2.705

$2.410

$2.314

Rochester

USA . 5,246 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

5,246

-

$1.890

$1.690

$1.590

RS (Exports)

UK . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.754

2,500

-

-

-

$3.754

Verical

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.112

10k+ parts

$1.988

2,400

-

-

$2.112

$1.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 270 parts In-Stock

1+ parts

$1.986

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$1.986

-

-

-

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$3.603

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$3.603

-

-

-

Vyrian

USA . 2,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,701

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,735 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

2,735

$1.780

-

-

-

Semicontronic

India . 2,434 parts In-Stock

1+ parts

$1.780

100+ parts

$1.736

1k+ parts

$1.727

10k+ parts

-

2,434

$1.780

$1.736

$1.727

-

Corphita

USA . 774 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

774

$1.881

-

-

-

Continental Prestige Electronics

USA . 5,603 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

$3.528

5,603

$3.600

-

-

$3.528

Argo Parts USA

USA . 3,331 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

3,331

$3.600

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.603

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$3.603

-

-

-

Modulus Dynamics

Lithuania . 847 parts In-Stock

1+ parts

$5.797

100+ parts

$5.565

1k+ parts

$5.333

10k+ parts

-

847

$5.797

$5.565

$5.333

-

Aztec Data Supply Inc.

USA . 17,574 parts In-Stock

1+ parts

$6.422

100+ parts

-

1k+ parts

-

10k+ parts

-

17,574

$6.422

-

-

-

Corohmni

South Africa . 213 parts In-Stock

1+ parts

$23.740

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$23.740

-

-

-

Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Lixinc

USA . 8,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,545

-

-

-

-

Eastek

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

RC Electronics

USA . 5,242 parts In-Stock

1+ parts

-

100+ parts

$3.670

1k+ parts

$3.350

10k+ parts

$3.250

5,242

-

$3.670

$3.350

$3.250

Perfect Parts

USA . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18

-

-

-

-

Overview

Unlock the potential of your electronic designs with the TLE5012BE5020XUMA1 by Infineon Technologies. Known for its top-quality manufacturing, Infineon Technologies delivers innovative solutions in the category of Other Function Semiconductors. This product offers unparalleled value and benefits, making it the perfect choice for a wide range of applications. Experience the reliability and performance that Infineon Technologies is known for and take your projects to new heights with the TLE5012BE5020XUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the semiconductor, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and integration with other components on a circuit board, saving space and facilitating efficient production.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and makes the product versatile for different electronic systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the semiconductor to other components or circuits, allowing for various functionalities and designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the semiconductor.

Technical Specifications

Other Function Semiconductors TLE5012BE5020XUMA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

4 mm

Trade Compliance

TLE5012BE5020XUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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