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TLE5014S16DXUMA1

Infineon Technologies

TLE5014S16DXUMA1 by Infineon Technologies

ANALOG CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;

Median Price

$7.145

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 6,024 parts In-Stock

1+ parts

$7.690

100+ parts

-

1k+ parts

-

10k+ parts

-

6,024

$7.690

-

-

-

DigiKey

USA . 101 parts In-Stock

1+ parts

$8.270

100+ parts

$6.339

1k+ parts

$5.867

10k+ parts

$5.519

101

$8.270

$6.339

$5.867

$5.519

Farnell

UK . 6,045 parts In-Stock

1+ parts

$12.251

100+ parts

$7.096

1k+ parts

$6.350

10k+ parts

-

6,045

$12.251

$7.096

$6.350

-

Element14

Singapore . 6,045 parts In-Stock

1+ parts

-

100+ parts

$6.600

1k+ parts

$6.007

10k+ parts

-

6,045

-

$6.600

$6.007

-

Rochester

USA . 4,979 parts In-Stock

1+ parts

-

100+ parts

$4.790

1k+ parts

$4.280

10k+ parts

$4.030

4,979

-

$4.790

$4.280

$4.030

Verical

USA . 3,927 parts In-Stock

1+ parts

-

100+ parts

$5.987

1k+ parts

$5.350

10k+ parts

$5.037

3,927

-

$5.987

$5.350

$5.037

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 928 parts In-Stock

1+ parts

$5.064

100+ parts

-

1k+ parts

-

10k+ parts

-

928

$5.064

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.107

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$7.107

-

-

-

Bristol Electronics

USA . 2,302 parts In-Stock

1+ parts

$8.429

100+ parts

$3.962

1k+ parts

$3.624

10k+ parts

-

2,302

$8.429

$3.962

$3.624

-

Vyrian

USA . 4,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,190

-

-

-

-

Dan-Mar Components

USA . 2,302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,302

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,262 parts In-Stock

1+ parts

$4.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,262

$4.530

-

-

-

Corphita

USA . 35 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$4.797

-

-

-

Continental Prestige Electronics

USA . 4,760 parts In-Stock

1+ parts

$7.107

100+ parts

-

1k+ parts

-

10k+ parts

$6.965

4,760

$7.107

-

-

$6.965

Modulus Dynamics

Lithuania . 4,487 parts In-Stock

1+ parts

$7.630

100+ parts

$7.325

1k+ parts

$7.020

10k+ parts

-

4,487

$7.630

$7.325

$7.020

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Argo Parts USA

USA . 1,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,624

-

-

-

-

Technical Specifications

Other Function Semiconductors TLE5014S16DXUMA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Other IC type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Terminal Finish:

TIN

Trade Compliance

TLE5014S16DXUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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