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TLE5012BDE9200XUMA1

Infineon Technologies

TLE5012BDE9200XUMA1 by Infineon Technologies

TLE5012BDE9200XUMA1 by Infineon is a CMOS analog circuit with 16 terminals, operating b/w -40 to 125°C. It has a supply voltage of 5V and is AEC-Q100 compliant for automotive applications. The package style is small outline, thin profile, with shrink pitch, making it suitable for surface mount assembly.

Median Price

$4.438

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,471 parts In-Stock

1+ parts

$4.650

100+ parts

-

1k+ parts

-

10k+ parts

-

2,471

$4.650

-

-

-

DigiKey

USA . 7,047 parts In-Stock

1+ parts

$6.080

100+ parts

$4.614

1k+ parts

$4.152

10k+ parts

$3.992

7,047

$6.080

$4.614

$4.152

$3.992

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.530

5,000

-

-

-

$3.530

Avnet

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$3.103

5,000

-

-

-

$3.103

Rochester

USA . 2,516 parts In-Stock

1+ parts

-

100+ parts

$3.380

1k+ parts

$3.030

10k+ parts

$2.850

2,516

-

$3.380

$3.030

$2.850

Farnell

UK . 2,500 parts In-Stock

1+ parts

-

100+ parts

$5.370

1k+ parts

$4.800

10k+ parts

-

2,500

-

$5.370

$4.800

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Element14

Singapore . 2,500 parts In-Stock

1+ parts

-

100+ parts

$7.580

1k+ parts

$7.100

10k+ parts

-

2,500

-

$7.580

$7.100

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Verical

USA . 1,568 parts In-Stock

1+ parts

-

100+ parts

$4.225

1k+ parts

$3.788

10k+ parts

$3.563

1,568

-

$4.225

$3.788

$3.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 371 parts In-Stock

1+ parts

$5.766

100+ parts

-

1k+ parts

-

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371

$5.766

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$7.410

100+ parts

-

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-

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15

$7.410

-

-

-

IBS Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$4.951

5,000

-

-

-

$4.951

Vyrian

USA . 3,519 parts In-Stock

1+ parts

-

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3,519

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-

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Distributors (Availability)

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Corohmni

South Africa . 946 parts In-Stock

1+ parts

$2.596

100+ parts

-

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946

$2.596

-

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Semicontronic

India . 3,420 parts In-Stock

1+ parts

$3.200

100+ parts

$3.120

1k+ parts

$3.104

10k+ parts

-

3,420

$3.200

$3.120

$3.104

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Aztec Data Supply Inc.

USA . 395 parts In-Stock

1+ parts

$3.969

100+ parts

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395

$3.969

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-

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Modulus Dynamics

Lithuania . 2,897 parts In-Stock

1+ parts

$4.322

100+ parts

$4.149

1k+ parts

$3.976

10k+ parts

-

2,897

$4.322

$4.149

$3.976

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Corphita

USA . 409 parts In-Stock

1+ parts

$5.463

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409

$5.463

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Ampacity Inc.

Singapore . 3,262 parts In-Stock

1+ parts

$6.970

100+ parts

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10k+ parts

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3,262

$6.970

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.410

100+ parts

$7.262

1k+ parts

-

10k+ parts

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2,000

$7.410

$7.262

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-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$17.606

100+ parts

$16.726

1k+ parts

$16.726

10k+ parts

-

1,000

$17.606

$16.726

$16.726

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iodParts Technologies Inc.

India . 8,021 parts In-Stock

1+ parts

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8,021

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Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

$6.650

1k+ parts

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2,500

-

$6.650

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Argo Parts USA

USA . 2,248 parts In-Stock

1+ parts

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2,248

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Unlock the power of precision with the TLE5012BDE9200XUMA1 by Infineon Technologies. Crafted with excellence, this semiconductor offers unparalleled quality and reliability. Ideal for automotive applications, this product is designed to provide accurate and efficient performance. Experience the value of seamless integration and superior functionality with this innovative solution. Elevate your projects with the benefits and advantages that only Infineon Technologies can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material offers good thermal performance and mechanical strength, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on a PCB, saving space and simplifying assembly processes.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the product meets stringent automotive industry requirements for reliability and performance in harsh environments.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard supply voltage of 5V makes the product compatible with a wide range of applications and ensures reliable performance.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for high-density mounting and space-saving design, ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand elevated temperatures and harsh operating conditions, suitable for automotive and industrial applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has a moderate level of moisture sensitivity, allowing for safe and reliable soldering during assembly processes.

Technical Specifications

Other Function Semiconductors TLE5012BDE9200XUMA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Additional Features:

ALSO REQUIRE SUPPLIES FROM IN BETWEEN 3V AND 3.6V, 4.5V AND 5.5V

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TLE5012BDE9200XUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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