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TLE5309DE5201XUMA1

Infineon Technologies

TLE5309DE5201XUMA1 by Infineon Technologies

TLE5309DE5201XUMA1 by Infineon operates at a supply voltage range of 3-3.6V, suitable for automotive applications with a temperature range of -40 to 125°C. This IC features 16 terminals in a small outline package with gull wing terminals and is designed for analog circuit functions. Its compact size of 5x3.9mm makes it ideal for space-constrained designs requiring surface mount technology.

Median Price

$4.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 49,997 parts In-Stock

1+ parts

-

100+ parts

$3.560

1k+ parts

$3.190

10k+ parts

$3.000

49,997

-

$3.560

$3.190

$3.000

DigiKey

USA . 49,997 parts In-Stock

1+ parts

-

100+ parts

$4.690

1k+ parts

-

10k+ parts

-

49,997

-

$4.690

-

-

Verical

USA . 27,500 parts In-Stock

1+ parts

-

100+ parts

$4.450

1k+ parts

$3.987

10k+ parts

$3.750

27,500

-

$4.450

$3.987

$3.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 336 parts In-Stock

1+ parts

$3.762

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$3.762

-

-

-

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$4.575

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$4.575

-

-

-

Vyrian

USA . 49,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49,603

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 49,933 parts In-Stock

1+ parts

$3.370

100+ parts

-

1k+ parts

-

10k+ parts

-

49,933

$3.370

-

-

-

Semicontronic

India . 42,043 parts In-Stock

1+ parts

$3.370

100+ parts

$3.286

1k+ parts

$3.269

10k+ parts

-

42,043

$3.370

$3.286

$3.269

-

Corphita

USA . 371 parts In-Stock

1+ parts

$3.564

100+ parts

-

1k+ parts

-

10k+ parts

-

371

$3.564

-

-

-

Modulus Dynamics

Lithuania . 1,679 parts In-Stock

1+ parts

$3.875

100+ parts

$3.720

1k+ parts

$3.565

10k+ parts

-

1,679

$3.875

$3.720

$3.565

-

Corohmni

South Africa . 916 parts In-Stock

1+ parts

$3.875

100+ parts

-

1k+ parts

-

10k+ parts

-

916

$3.875

-

-

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$3.991

100+ parts

$3.792

1k+ parts

$3.792

10k+ parts

-

270

$3.991

$3.792

$3.792

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.575

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$4.575

-

-

-

Aztec Data Supply Inc.

USA . 1,334 parts In-Stock

1+ parts

$16.780

100+ parts

-

1k+ parts

-

10k+ parts

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1,334

$16.780

-

-

-

Continental Prestige Electronics

USA . 666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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666

-

-

-

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Argo Parts USA

USA . 97 parts In-Stock

1+ parts

-

100+ parts

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97

-

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Perfect Parts

USA . 11 parts In-Stock

1+ parts

-

100+ parts

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11

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Overview

Unleash the power of innovation with the TLE5309DE5201XUMA1 by Infineon Technologies. Embrace superior quality, reliability, and performance from a trusted manufacturer in the semiconductor industry. This versatile product falls under the category of Other Function Semiconductors, delivering exceptional value across various applications. Elevate your projects with the advantages of this cutting-edge technology, offering customers unparalleled benefits and advantages that drive success and efficiency. Choose the TLE5309DE5201XUMA1 for a seamless integration into your systems and experience the difference in quality firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications, offering compatibility with common power sources.

No. of Terminals: 16

Provides multiple connection points for various inputs and outputs, increasing the versatility of the product.

Maximum Operating Temperature: 125 °C

Ensures stable performance even in high-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: TIN

Enhances conductivity and reliability of the connections, ensuring optimal performance.

Width (mm): 3.9 mm

Compact size allows for space-saving in designs, especially useful in applications with limited space.

Minimum Supply Voltage (Vsup): 3 V

Offers flexibility in power input requirements, accommodating a range of power sources.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh operating conditions in automotive environments, ensuring durability and reliability.

Moisture Sensitivity Level (MSL): 3

Indicates that the product can withstand some levels of moisture exposure, suitable for various environmental conditions.

Maximum Supply Voltage (Vsup): 3.6 V

Provides a safety margin for power input, preventing damage from power fluctuations.

Technical Specifications

Other Function Semiconductors TLE5309DE5201XUMA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Additional Features:

ALSO REQUIRE SUPPLY VDD, AMR RANGES FROM 4.5V TO 5.5V

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TLE5309DE5201XUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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