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TLE5012BE5000FUMA1

Infineon Technologies

TLE5012BE5000FUMA1 by Infineon Technologies

TLE5012BE5000FUMA1 by Infineon Technologies is a small outline, surface mount analog circuit with 8 terminals. It operates on a supply voltage range of 3V to 5.5V and has a max seated height of 1.75mm. This IC is commonly used in applications requiring precise position sensing.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 76,093 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

76,093

-

$2.190

$1.960

$1.850

Verical

USA . 76,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

76,093

-

-

$2.450

$2.313

Flip Electronics (Authorized)

USA . 17,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 981 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

981

$2.318

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$2.850

-

-

-

Flip Electronics

USA . 17,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,500

-

-

-

-

Vyrian

USA . 10,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,632

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 46,486 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

46,486

$2.070

-

-

-

Semicontronic

India . 46,461 parts In-Stock

1+ parts

$2.070

100+ parts

$2.018

1k+ parts

$2.008

10k+ parts

-

46,461

$2.070

$2.018

$2.008

-

Corphita

USA . 871 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$2.196

-

-

-

Modulus Dynamics

Lithuania . 4,234 parts In-Stock

1+ parts

$2.301

100+ parts

$2.209

1k+ parts

$2.117

10k+ parts

-

4,234

$2.301

$2.209

$2.117

-

Corohmni

South Africa . 577 parts In-Stock

1+ parts

$2.301

100+ parts

-

1k+ parts

-

10k+ parts

-

577

$2.301

-

-

-

Continental Prestige Electronics

USA . 6,769 parts In-Stock

1+ parts

$2.735

100+ parts

-

1k+ parts

-

10k+ parts

$2.681

6,769

$2.735

-

-

$2.681

Argo Parts USA

USA . 4,467 parts In-Stock

1+ parts

$2.735

100+ parts

-

1k+ parts

-

10k+ parts

-

4,467

$2.735

-

-

-

AZTECH Wire

Italy . 470 parts In-Stock

1+ parts

$9.990

100+ parts

-

1k+ parts

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10k+ parts

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470

$9.990

-

-

-

Aztec Data Supply Inc.

USA . 58 parts In-Stock

1+ parts

$19.862

100+ parts

-

1k+ parts

-

10k+ parts

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58

$19.862

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.793

1k+ parts

$2.707

10k+ parts

$2.650

50

-

$2.793

$2.707

$2.650

Overview

Experience the cutting-edge technology of Infineon Technologies with the TLE5012BE5000FUMA1 semiconductor. This advanced solution offers unparalleled quality and numerous advantages that set it apart from others in its category. With its compact design and surface mount capability, this product is perfect for a wide range of applications. From automotive systems to industrial machinery, the TLE5012BE5000FUMA1 delivers exceptional performance and reliability. Its nominal supply voltage of 5V ensures stable operation, while its small outline package style makes installation a breeze. Discover the value, benefits, and advantages that this innovative product brings to your projects and elevate your designs to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external damage, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this product offers easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 1

This product is designed with a single function, providing simplicity in circuit design and optimization for specific applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient PCB layout, maximizing utilization of available area.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal voltage of 5 V, this product offers compatibility with standard power systems, ensuring easy integration.

No. of Terminals: 8

With 8 terminals, this product provides sufficient connectivity options, enabling versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compactness and space-saving advantages, making it suitable for applications with limited board space.

Terminal Finish: TIN

The terminal finish of tin provides excellent solderability, ensuring reliable and durable connections during PCB assembly.

Terminal Position: DUAL

With dual terminal positions, this product allows for flexible and convenient board-to-board connections, enhancing design versatility.

Maximum Seated Height: 1.75 mm

The low maximum seated height contributes to a thinner profile, making it suitable for slim and compact electronic devices.

Width (mm): 4 mm

With a width of 4 mm, this product offers a compact form factor, allowing for efficient space utilization within the system.

Other IC type: ANALOG CIRCUIT

The product being an analog circuit IC enables precise and accurate signal processing, making it suitable for various audio and sensor applications.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3 V, this product allows for lower power consumption, contributing to energy-efficient designs.

Length: 5 mm

The length of 5 mm ensures a compact footprint, facilitating seamless integration into space-constrained electronic devices.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical strength and reliable electrical connections, enhancing the product's overall reliability.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product allows for easy PCB trace routing and assembly, simplifying the manufacturing process.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates a moderate sensitivity to moisture, ensuring proper handling and storage requirements for optimal performance.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5 V, this product offers a wide voltage range for compatibility with different power sources.

Technical Specifications

Other Function Semiconductors TLE5012BE5000FUMA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

4 mm

Trade Compliance

TLE5012BE5000FUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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