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XTR116U/2K5G4

Texas Instruments

XTR116U/2K5G4 by Texas Instruments

XTR116U/2K5G4 by Texas Instruments is an 8-terminal analog circuit IC with a supply voltage range of 7.5V to 36V, suitable for industrial applications. It features a small outline package style, operates b/w -40°C to 85°C, and has a peak reflow temperature of 260°C. Ideal for use in various electronic systems requiring precise signal conditioning and amplification.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 21,610 parts In-Stock

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Vyrian

USA . 7,967 parts In-Stock

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Digiode

USA . 3,691 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Corohmni

South Africa . 41 parts In-Stock

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$1.251

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41

$1.251

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One Stop Electronics

USA . 596 parts In-Stock

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$2.500

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596

$2.500

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$5.500

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335

$5.500

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Semicontronic

India . 990 parts In-Stock

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$6.500

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$6.338

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$6.305

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990

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 757 parts In-Stock

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$6.805

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757

$6.805

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Advanced Electronics

New Zealand . 1,200 parts In-Stock

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$7.492

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$7.417

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$7.117

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$7.492

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$7.117

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Parana Technologies

USA . 900 parts In-Stock

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$13.826

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$14.311

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900

$13.826

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$14.311

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ChromeModa Solutions

Germany . 2,113 parts In-Stock

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$15.535

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$12.739

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$15.535

$12.739

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IDEA Electronic Components Group

UK . 1,800 parts In-Stock

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$15.535

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$14.758

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$13.982

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$14.758

$13.982

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Continental Prestige Electronics

USA . 6,965 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 3,152 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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$44.769

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$44.769

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$44.769

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$44.769

$44.769

$44.769

Lucentia Tech

USA . 2,000 parts In-Stock

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$44.769

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$44.769

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$44.769

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$44.769

$44.769

Microchip USA

USA . 1,779 parts In-Stock

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DigiPath Technology Company

USA . 1,679 parts In-Stock

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$14.006

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Corphita

USA . 511 parts In-Stock

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511

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 76 parts In-Stock

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Modulus Dynamics

Lithuania . 59 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the XTR116U/2K5G4, a versatile semiconductor that offers unmatched performance in various applications. This product is designed to provide seamless integration and consistent power supplies, making it ideal for industrial settings where precision is key. With a compact design and advanced technology, the XTR116U/2K5G4 delivers superior results while ensuring durability and longevity. Invest in excellence with Texas Instruments and elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good durability and protection for the semiconductor components, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily accommodated in various electronic designs, making it a versatile choice.

Nominal Supply Voltage (Vsup): 24 V

Operating at a nominal supply voltage of 24V makes this semiconductor suitable for applications where this voltage level is required.

Power Supplies (V): 24

Having power supplies of 24V enables compatibility with systems that operate at this voltage, offering a reliable power source for the semiconductor.

No. of Terminals: 8

With 8 terminals, this semiconductor provides multiple connection points for interfacing with external circuits, offering flexibility in design and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style is space-saving and efficient, making it suitable for compact electronic devices or systems where size constraints are a concern.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, this semiconductor can withstand higher temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this semiconductor is suitable for use in both extreme cold and hot conditions, offering versatility in application.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for the semiconductor.

Terminal Position: DUAL

Dual terminal position offers redundancy and increased reliability in circuit connections, reducing the risk of signal loss or failure.

Maximum Seated Height: 1.75 mm

Low maximum seated height of 1.75mm allows for a compact overall design, suitable for applications where space constraints are a consideration.

Width (mm): 3.9 mm

Narrow width of 3.9mm provides a space-saving solution for incorporating the semiconductor into tight layouts or densely packed circuit boards.

Other IC type: ANALOG CIRCUIT

Analog circuit type offers precise and continuous signal processing capabilities, making this semiconductor suitable for applications that require high-quality analog performance.

Minimum Supply Voltage (Vsup): 7.5 V

With a minimum supply voltage of 7.5V, this semiconductor can operate efficiently at lower voltage levels, offering versatility in power requirements.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable soldering and assembly processes, maintaining structural integrity during manufacturing.

Length: 4.9 mm

Compact length of 4.9mm allows for easy integration into electronic designs with limited space, making it a versatile choice for various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments or industrial settings, offering durability and stability under tough conditions.

Technology: BIPOLAR

Bipolar technology provides fast switching speeds and high-performance capabilities, making this semiconductor ideal for applications that require precision and efficiency.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections, enhancing the overall stability and performance of the semiconductor in various operating conditions.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this semiconductor allows for precise and consistent connections, ensuring proper alignment and reliable electrical contact.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that this semiconductor requires careful handling during storage and assembly to prevent moisture-related damage, ensuring product quality and longevity.

Maximum Supply Voltage (Vsup): 36 V

Capable of handling a maximum supply voltage of 36V, this semiconductor offers versatility in power requirements and compatibility with systems that operate at higher voltage levels.

Technical Specifications

Other Function Semiconductors XTR116U/2K5G4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

7.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

XTR116U/2K5G4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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