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LM334M

Texas Instruments

LM334M by Texas Instruments

LM334M by Texas Instruments is a small outline analog circuit with 8 terminals. It operates b/w 0-70°C, with a supply voltage range of 0.8-40V. This bipolar technology IC is used in various applications requiring precise temperature monitoring and control.

Median Price

$1.006

Lifecycle Status

Suppliers In-Stock

54

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 5,897 parts In-Stock

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$0.969

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$0.805

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Verical

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DigiKey

USA . 907 parts In-Stock

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DF Sales Co.

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Digiode

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Component Electronics Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,986 parts In-Stock

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$0.670

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$0.670

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Semicontronic

India . 3,808 parts In-Stock

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$0.670

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$0.653

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$0.650

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Corphita

USA . 1,859 parts In-Stock

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$0.714

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Argo Parts USA

USA . 4,494 parts In-Stock

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$0.759

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Continental Prestige Electronics

USA . 3,813 parts In-Stock

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$0.759

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$0.744

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Netroflash

USA . 500 parts In-Stock

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$0.880

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$0.836

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$0.819

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$0.880

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$0.819

Corohmni

South Africa . 734 parts In-Stock

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$4.173

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$4.173

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$8.155

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$7.747

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$7.747

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$8.155

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Parana Technologies

USA . 352 parts In-Stock

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$19.811

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$19.770

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$19.811

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DigiPath Technology Company

USA . 2,325 parts In-Stock

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$21.814

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ChromeModa Solutions

Germany . 5,673 parts In-Stock

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$22.259

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$18.252

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IDEA Electronic Components Group

UK . 1,147 parts In-Stock

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$22.259

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$21.146

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$20.033

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$20.033

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Metaverse IC Inc.

Canada . 19,950 parts In-Stock

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USA . 19,264 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments LM334M semiconductor. Crafted with expertise by a renowned manufacturer, this high-quality component excels in a variety of applications. From analog circuits to temperature sensing, this versatile product offers unmatched value and performance. Experience the benefits of seamless integration, superior reliability, and exceptional efficiency. Elevate your projects with the LM334M and discover endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability to the semiconductor, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment during assembly.

No. of Terminals: 8

Having multiple terminals allows for more connections and functionalities in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this semiconductor can withstand a range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the semiconductor can function in cooler environments as well.

Terminal Finish: Tin/Lead (Sn/Pb)

This finish provides good conductivity and corrosion resistance for the terminals.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and connection possibilities.

Maximum Seated Height: 1.75 mm

The low seated height allows for a slim profile and compact design of the semiconductor component.

Width (mm): 3.9 mm

The narrow width makes it suitable for applications where space is limited.

Other IC type: ANALOG CIRCUIT

Analog circuits are essential for many electronic devices, making this semiconductor versatile for various applications.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage allows for efficient power consumption in the circuit.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, this semiconductor can withstand the soldering process during assembly.

Length: 4.9 mm

The compact length makes it suitable for small electronic devices and space-constrained applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes this semiconductor suitable for standard consumer electronic products.

Technology: BIPOLAR

Bipolar technology offers high performance and reliability in analog circuits, making this semiconductor a dependable choice.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and secure connections to the circuit board.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy integration into common circuit board layouts and designs.

Maximum Supply Voltage (Vsup): 40 V

The high maximum supply voltage allows for flexibility in voltage requirements for different applications.

Technical Specifications

Other Function Semiconductors LM334M attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

.8 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

LM334M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-535-6581, 5962015356581

NIIN

015356581

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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