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LM334MDC

Texas Instruments

LM334MDC by Texas Instruments

LM334MDC by Texas Instruments is a surface mount analog circuit with a temperature range of 0-70°C. It operates on a supply voltage b/w 1-40V, making it suitable for commercial applications requiring precise temperature control in compact designs. The unencased chip package style and bipolar technology further enhance its versatility in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,145

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-

-

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Digiode

USA . 3,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,406

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-

-

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Anansix

USA . 2,865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,865

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 871 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$5.500

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-

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AZTECH Wire

Italy . 237 parts In-Stock

1+ parts

$12.702

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$12.702

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-

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Parana Technologies

USA . 1,780 parts In-Stock

1+ parts

$20.492

100+ parts

-

1k+ parts

$20.558

10k+ parts

-

1,780

$20.492

-

$20.558

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ChromeModa Solutions

Germany . 4,154 parts In-Stock

1+ parts

$23.025

100+ parts

$18.880

1k+ parts

-

10k+ parts

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4,154

$23.025

$18.880

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IDEA Electronic Components Group

UK . 315 parts In-Stock

1+ parts

$23.025

100+ parts

$21.874

1k+ parts

$20.722

10k+ parts

-

315

$23.025

$21.874

$20.722

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Corphita

USA . 3,575 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,575

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DigiPath Technology Company

USA . 1,643 parts In-Stock

1+ parts

-

100+ parts

$20.759

1k+ parts

-

10k+ parts

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1,643

-

$20.759

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Overview

Unlock the power of innovation with the LM334MDC by Texas Instruments. This cutting-edge semiconductor offers unparalleled quality and reliability, backed by the trusted name of a leading manufacturer. Ideal for a variety of applications in the digital world, this product provides unmatched value and benefits to customers. Experience the advantages of superior performance and efficiency, making it the perfect choice for your next project. Join the countless satisfied users who have already discovered the incredible possibilities that the LM334MDC has to offer.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving both time and cost.

Package Style (Meter): UNCASED CHIP

Uncased chip packaging reduces the overall size and weight of the product, making it suitable for compact electronic designs.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures reliable operation in various environmental conditions.

Terminal Position: UPPER

The upper terminal position makes it easier to connect the product in a circuit layout, simplifying assembly.

Other IC type: ANALOG CIRCUIT

Analog circuits are essential for processing real-world signals accurately, making this product suitable for a wide range of applications.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage allows for operation in low-power applications, saving energy.

Temperature Grade: COMMERCIAL

Commercial-grade components are suitable for standard commercial applications, offering a cost-effective solution.

Technology: BIPOLAR

Bipolar technology provides high-speed performance and precise signal processing, making this product ideal for demanding applications.

Terminal Form: NO LEAD

No-lead terminal form offers shorter signal paths, reducing signal loss and improving overall performance.

Maximum Supply Voltage (Vsup): 40 V

With a high maximum supply voltage, this product can handle higher voltage inputs without damage, enhancing reliability.

Technical Specifications

Other Function Semiconductors LM334MDC attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

1 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM334MDC Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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