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LSM6DS3HTR

STMicroelectronics

LSM6DS3HTR by STMicroelectronics

STMicroelectronics LSM6DS3HTR is a CMOS analog circuit with 14 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.71V to 3.6V and comes in a compact rectangular package suitable for industrial applications. The surface-mount device features a very thin profile and fine pitch design, making it ideal for various functions in the semiconductor industry.

Median Price

$1.574

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Demsay Elektronik

Türkiye . 664 parts In-Stock

1+ parts

$0.029

100+ parts

$0.029

1k+ parts

$0.029

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$0.029

664

$0.029

$0.029

$0.029

$0.029

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.120

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300

$3.120

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Digiode

USA . 4,470 parts In-Stock

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4,470

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Vyrian

USA . 3,477 parts In-Stock

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3,477

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North Shore Components

USA . 2,097 parts In-Stock

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2,097

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Anansix

USA . 829 parts In-Stock

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829

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Rebound Electronics

UK . 411 parts In-Stock

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411

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Bristol Electronics

USA . 178 parts In-Stock

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Atlantic Semiconductor

USA . 168 parts In-Stock

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Halfin

Belgium . 25 parts In-Stock

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25

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PC Components Company LLC

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 787 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

787

$0.500

$0.488

$0.485

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Continental Prestige Electronics

USA . 6,278 parts In-Stock

1+ parts

$2.360

100+ parts

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$2.313

6,278

$2.360

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-

$2.313

Argo Parts USA

USA . 1,479 parts In-Stock

1+ parts

$2.360

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1,479

$2.360

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$2.360

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300

$2.360

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Corohmni

South Africa . 919 parts In-Stock

1+ parts

$2.410

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919

$2.410

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$2.482

100+ parts

$2.358

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$2.358

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-

200

$2.482

$2.358

$2.358

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.058

100+ parts

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$2.935

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100

$3.058

-

$2.935

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Modulus Dynamics

Lithuania . 77 parts In-Stock

1+ parts

$3.463

100+ parts

$3.429

1k+ parts

$3.325

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77

$3.463

$3.429

$3.325

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Ampacity Inc.

Singapore . 606 parts In-Stock

1+ parts

$4.500

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606

$4.500

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AZTECH Wire

Italy . 267 parts In-Stock

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$4.973

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$4.973

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IDEA Electronic Components Group

UK . 1,291 parts In-Stock

1+ parts

$11.820

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$10.638

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$11.820

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MKK Technologies

India . 216 parts In-Stock

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$22.227

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216

$22.227

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DigiPath Technology Company

USA . 216 parts In-Stock

1+ parts

$22.227

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216

$22.227

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GreenTree Electronics

Israel . 65,000 parts In-Stock

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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Lixinc

USA . 16,305 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Assy Fe

Spain . 4,345 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,199 parts In-Stock

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3,199

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Parana Technologies

USA . 1,907 parts In-Stock

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$14.133

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$14.133

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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A-Z Elektronik GmbH

Germany . 602 parts In-Stock

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602

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Corphita

USA . 148 parts In-Stock

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148

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Perfect Parts

USA . 146 parts In-Stock

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146

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Overview

Get ready to experience unparalleled performance with the LSM6DS3HTR by STMicroelectronics. Crafted with precision and expertise, this sensor offers unbeatable quality and reliability. Ideal for a wide range of applications, this product is designed to exceed your expectations. With its advanced features and cutting-edge technology, the LSM6DS3HTR provides unmatched value, benefits, and advantages to customers. Elevate your projects and unleash endless possibilities with this exceptional semiconductor from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the semiconductor components inside.

Surface Mount: YES

Offers convenience in assembly and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 1.8 V

Suitable for low power consumption applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Technical Specifications

Other Function Semiconductors LSM6DS3HTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B14

Length:

3 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.86 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

LSM6DS3HTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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