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LSM6DS3H

STMicroelectronics

LSM6DS3H by STMicroelectronics

LSM6DS3H by STMicroelectronics is a CMOS analog circuit with 14 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.71V to 3.6V and measures 3x2.5mm in size, suitable for industrial applications requiring precise motion sensing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,702 parts In-Stock

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2,702

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Vyrian

USA . 714 parts In-Stock

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714

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Anansix

USA . 300 parts In-Stock

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300

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semicontronic

India . 901 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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901

$2.500

$2.438

$2.425

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AZTECH Wire

Italy . 580 parts In-Stock

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$5.945

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$5.945

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IDEA Electronic Components Group

UK . 801 parts In-Stock

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$6.939

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$6.245

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801

$6.939

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$6.245

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Ampacity Inc.

Singapore . 1,229 parts In-Stock

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$7.500

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$7.500

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MKK Technologies

India . 1,070 parts In-Stock

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$13.048

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DigiPath Technology Company

USA . 1,070 parts In-Stock

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$13.048

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$13.048

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Corohmni

South Africa . 807 parts In-Stock

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$17.511

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807

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Aztec Data Supply Inc.

USA . 37 parts In-Stock

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$22.040

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Lixinc

USA . 16,743 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 2,319 parts In-Stock

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$8.296

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Continental Prestige Electronics

USA . 560 parts In-Stock

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560

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corphita

USA . 380 parts In-Stock

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380

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Argo Parts USA

USA . 143 parts In-Stock

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143

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Overview

Experience the next level of precision and performance with the LSM6DS3H by STMicroelectronics. Crafted with top-notch materials and cutting-edge technology, this sensor offers unparalleled reliability and accuracy for a wide range of applications. From industrial automation to consumer electronics, the LSM6DS3H delivers superior results with its advanced features and robust design. Trust in STMicroelectronics to bring you quality products that provide value, benefits, and advantages like never before. Elevate your projects with the LSM6DS3H and experience excellence at every turn.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it convenient for compact designs.

Package Shape: RECTANGULAR

The rectangular shape is common and standardized, making it compatible with a wide range of applications and designs.

Nominal Supply Voltage (Vsup): 1.8 V

The low supply voltage requirement makes it energy-efficient and suitable for battery-powered devices.

No. of Terminals: 14

With a sufficient number of terminals, this product offers flexibility in connectivity options for different circuit configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style ensures efficient heat dissipation, space-saving layout, and precise connections for optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended usage.

Minimum Operating Temperature: -40 °C

The wide temperature range of operation makes this product suitable for both extreme cold and hot environments.

Terminal Position: BOTTOM

The placement of terminals at the bottom allows for easy and secure soldering onto the PCB, ensuring reliable connections.

Maximum Seated Height: 0.86 mm

The low seated height of the package enables compact designs and efficient use of space on the PCB.

Width (mm): 2.5 mm

The slim width of the package contributes to space-saving designs and allows for high-density mounting on the PCB.

Other IC type: ANALOG CIRCUIT

This product's analog circuit type supports precise signal processing, making it ideal for applications requiring accurate data interpretation.

Minimum Supply Voltage (Vsup): 1.71 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources and extends the product's versatility.

Length: 3 mm

The compact length of the package facilitates space-saving designs and allows for efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating makes this product suitable for rugged applications and ensures reliable performance in demanding environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and high-speed operation, enhancing its overall efficiency.

Terminal Form: BUTT

The butt terminal form facilitates easy and secure connections, ensuring stable electrical contacts for optimal performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting, precise connections, and efficient signal routing on the PCB.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance allows for flexibility in power supply options and ensures compatibility with various operating conditions.

Technical Specifications

Other Function Semiconductors LSM6DS3H attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B14

Length:

3 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.86 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

LSM6DS3H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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