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LSM6DS0TR

STMicroelectronics

LSM6DS0TR by STMicroelectronics

STMicroelectronics LSM6DS0TR is a 16-terminal IC with a supply voltage range of 1.71V to 3.6V, operating b/w -40 °C to 85°C. Its package style is grid array, very thin profile, fine pitch for industrial applications requiring precise analog circuit performance in a compact square shape design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 20,284 parts In-Stock

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Vyrian

USA . 5,737 parts In-Stock

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5,737

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ACDS - Activité Composants Distribution Service

France . 1,895 parts In-Stock

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1,895

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Anansix

USA . 1,195 parts In-Stock

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Digiode

USA . 1,114 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 1,210 parts In-Stock

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$18.230

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$18.230

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IDEA Electronic Components Group

UK . 388 parts In-Stock

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$21.471

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$19.324

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388

$21.471

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$19.324

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MKK Technologies

India . 2,052 parts In-Stock

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$40.375

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$40.375

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DigiPath Technology Company

USA . 2,052 parts In-Stock

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$40.375

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$40.375

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Component Stockers USA

USA . 511 parts In-Stock

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$99.990

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$99.990

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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Perfect Parts

USA . 25,967 parts In-Stock

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Lixinc

USA . 15,538 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,352 parts In-Stock

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Metaverse IC Inc.

Canada . 8,050 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,355 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,685 parts In-Stock

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Glotronic Ltd.

UK . 1,348 parts In-Stock

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Parana Technologies

USA . 1,250 parts In-Stock

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$25.672

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$25.672

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 770 parts In-Stock

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Corphita

USA . 450 parts In-Stock

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450

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Overview

Experience the unbeatable quality and reliability of the LSM6DS0TR by STMicroelectronics, a leading manufacturer in the semiconductor industry. This cutting-edge sensor offers a wide range of applications in various industries, providing customers with precise and accurate measurements for their projects. With advanced technology and innovative design, this product guarantees exceptional performance and durability. Upgrade your devices with the LSM6DS0TR and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the product.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into various electronic designs and saves space on the circuit board.

Nominal Supply Voltage (Vsup): 2.2 V

Operates efficiently at a low supply voltage, making it suitable for applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable in various applications.

Technical Specifications

Other Function Semiconductors LSM6DS0TR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.86 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

LSM6DS0TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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