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LSM6DS3

STMicroelectronics

LSM6DS3 by STMicroelectronics

LSM6DS3 by STMicroelectronics is a CMOS analog circuit with 14 terminals and a supply voltage range of 1.71V to 3.6V. It operates in industrial temperature grades from -40°C to 85°C, making it suitable for various applications requiring precise motion sensing capabilities in compact form factors. With a very thin profile and fine pitch package style, this sensor is ideal for surface mount designs where space is limited.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 33,485 parts In-Stock

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Sensible Micro Corp

USA . 22,169 parts In-Stock

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Digiode

USA . 2,471 parts In-Stock

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Bristol Electronics

USA . 2,088 parts In-Stock

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Anansix

USA . 1,264 parts In-Stock

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Vyrian

USA . 341 parts In-Stock

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Nova Conductors

Japan . 64 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 385 parts In-Stock

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$4.945

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$4.945

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Semicontronic

India . 1,425 parts In-Stock

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$5.500

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$5.362

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$5.335

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$5.500

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Ampacity Inc.

Singapore . 1,050 parts In-Stock

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$6.500

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$6.500

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Corohmni

South Africa . 61 parts In-Stock

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$18.093

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IDEA Electronic Components Group

UK . 28 parts In-Stock

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$19.255

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$17.329

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Aztec Data Supply Inc.

USA . 2,932 parts In-Stock

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$22.670

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MKK Technologies

India . 2,274 parts In-Stock

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DigiPath Technology Company

USA . 2,274 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 5,002 parts In-Stock

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Argo Parts USA

USA . 3,435 parts In-Stock

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Corphita

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Perfect Parts

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Parana Technologies

USA . 537 parts In-Stock

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$23.022

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Explore limitless possibilities with the LSM6DS3 by STMicroelectronics, a high-quality sensor that offers unmatched precision and reliability. Manufactured by industry leader STMicroelectronics, this sensor is ideal for a wide range of applications in various industries. With its advanced technology and innovative design, customers can expect superior performance and accuracy in their projects. Experience the value and benefits of the LSM6DS3, and unlock new opportunities for success in your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 1.8 V

Optimized supply voltage for efficient and stable operation of the semiconductor.

No. of Terminals: 14

Offers ample connectivity options for various circuit configurations and applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, enhancing the efficiency and reliability of the semiconductor.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide range of supply voltages, making the semiconductor versatile and compatible in various systems.

Technical Specifications

Other Function Semiconductors LSM6DS3 attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-BU14

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LGA14,1X1,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.86 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

2.5 mm

Trade Compliance

LSM6DS3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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