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LSM6DSOX

STMicroelectronics

LSM6DSOX by STMicroelectronics

STMicroelectronics LSM6DSOX is a 14-terminal IC with CMOS technology, operating b/w -40 to 85°C. It features a very thin profile, fine pitch package style suitable for industrial applications. With a supply voltage range of 1.71V to 3.6V, it is ideal for analog circuit integration in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,392 parts In-Stock

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8,392

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Anansix

USA . 2,563 parts In-Stock

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2,563

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Digiode

USA . 2,158 parts In-Stock

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2,158

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Component Sense

UK . 933 parts In-Stock

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933

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PC Components Company LLC

USA . 332 parts In-Stock

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332

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Bristol Electronics

USA . 332 parts In-Stock

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332

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Amalfi Trading

USA . 7 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 660 parts In-Stock

1+ parts

$0.500

100+ parts

-

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660

$0.500

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Aztec Data Supply Inc.

USA . 2,368 parts In-Stock

1+ parts

$1.860

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2,368

$1.860

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Corohmni

South Africa . 282 parts In-Stock

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$4.373

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282

$4.373

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Semicontronic

India . 240 parts In-Stock

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$5.500

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$5.362

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$5.335

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240

$5.500

$5.362

$5.335

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$7.020

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$6.669

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$6.669

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2,000

$7.020

$6.669

$6.669

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IDEA Electronic Components Group

UK . 1,753 parts In-Stock

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$15.020

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$13.518

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$15.020

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$13.518

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AZTECH Wire

Italy . 268 parts In-Stock

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$18.687

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268

$18.687

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MKK Technologies

India . 1,132 parts In-Stock

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$28.244

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$28.244

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DigiPath Technology Company

USA . 1,132 parts In-Stock

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$28.244

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$28.244

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Lixinc

USA . 2,620 parts In-Stock

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Argo Parts USA

USA . 2,465 parts In-Stock

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Continental Prestige Electronics

USA . 1,795 parts In-Stock

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1,795

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Parana Technologies

USA . 1,541 parts In-Stock

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$17.959

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1,541

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$17.959

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Corphita

USA . 1,399 parts In-Stock

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1,399

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unleash the power of the LSM6DSOX by STMicroelectronics, a cutting-edge sensor that delivers unmatched quality and precision. Crafted by industry-leading experts, this sensor is perfect for a wide range of applications, offering customers unrivaled value and performance. Whether you're looking to enhance your wearable devices, drones, or industrial equipment, the LSM6DSOX provides the reliability and innovation you need to stay ahead of the curve. Experience the difference with STMicroelectronics and revolutionize your technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for protecting the internal components.

Surface Mount: YES

Easy to install and suitable for automated assembly processes.

Package Shape: RECTANGULAR

Compact design for efficient use of board space.

No. of Terminals: 14

Sufficient number of terminals for various connections and functions.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

High-density packaging for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures for reliable performance.

Minimum Operating Temperature: -40 °C

Able to operate in extreme cold environments.

Terminal Position: BOTTOM

Convenient terminal position for easy access and connection.

Maximum Seated Height: 0.86 mm

Low profile design for compact devices.

Width: 2.5 mm

Narrow width for fitting into tight spaces on the circuit board.

Other IC type: ANALOG CIRCUIT

Versatile functionality for a wide range of applications.

Minimum Supply Voltage (Vsup): 1.71 V

Low minimum voltage requirement for energy-efficient operation.

Length: 3 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with harsh conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed.

Terminal Form: BUTT

Reliable terminal form for secure connections.

Terminal Pitch: 0.5 mm

Fine pitch design for high-density mounting.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum voltage for powering a variety of components.

Technical Specifications

Other Function Semiconductors LSM6DSOX attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B14

Length:

3 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.86 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

LSM6DSOX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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