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XTR110KU/1KG4

Texas Instruments

XTR110KU/1KG4 by Texas Instruments

XTR110KU/1KG4 by Texas Instruments is a 16-terminal analog circuit IC with a supply voltage range of 13.5V to 40V, suitable for commercial-grade applications. It features a small outline package style, gull wing terminal form, and operates at temperatures from 0°C to 70°C. Ideal for various electronic systems requiring precise signal processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 22,230 parts In-Stock

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Vyrian

USA . 4,473 parts In-Stock

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4,473

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Digiode

USA . 4,349 parts In-Stock

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4,349

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Nova Conductors

Japan . 61 parts In-Stock

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One Stop Electronics

USA . 1,224 parts In-Stock

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$1.500

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1,224

$1.500

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Semicontronic

India . 1,554 parts In-Stock

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$2.500

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$2.438

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$2.425

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1,554

$2.500

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$2.425

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Parana Technologies

USA . 1,806 parts In-Stock

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$2.507

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$2.996

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$2.507

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$2.996

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DigiPath Technology Company

USA . 2,171 parts In-Stock

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$2.761

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$2.761

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ChromeModa Solutions

Germany . 4,019 parts In-Stock

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$2.817

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$2.310

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4,019

$2.817

$2.310

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IDEA Electronic Components Group

UK . 2,358 parts In-Stock

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$2.817

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$2.535

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$2.817

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$3.436

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$3.264

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$3.264

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60

$3.436

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$3.264

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AZTECH Wire

Italy . 679 parts In-Stock

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$5.372

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Ampacity Inc.

Singapore . 686 parts In-Stock

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$7.500

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Corohmni

South Africa . 200 parts In-Stock

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$10.182

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Corphita

USA . 4,904 parts In-Stock

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Argo Parts USA

USA . 2,893 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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$72.604

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$72.604

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$72.604

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$72.604

Lucentia Tech

USA . 950 parts In-Stock

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$72.604

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$72.604

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$72.604

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Modulus Dynamics

Lithuania . 700 parts In-Stock

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Continental Prestige Electronics

USA . 449 parts In-Stock

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Bastille Electronics

Australia . 58 parts In-Stock

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Overview

Discover the cutting-edge technology of the XTR110KU/1KG4 by Texas Instruments, a top-tier manufacturer known for its reliable products. This versatile semiconductor is perfect for a wide range of applications, offering customers high-quality performance and value. With a sleek rectangular package style and dual terminal position, this product is designed for maximum efficiency. Whether you're in need of an analog circuit for industrial or commercial use, the XTR110KU/1KG4 is the ideal choice. Trust Texas Instruments to deliver excellence with every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

With surface mount capability, this product is easy to install and saves space on PCBs, making it efficient for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and orientation during assembly, enhancing the convenience of integration.

Nominal Supply Voltage (Vsup): 24 V

Operating at a nominal supply voltage of 24V, this product is suitable for applications requiring consistent power levels.

Power Supplies (V): 24

Designed to run on a 24V power supply, this product ensures compatibility with standard voltage sources.

No. of Terminals: 16

The high number of terminals provides flexibility in connectivity options, allowing for versatile usage in different circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling more components to be accommodated in tight layouts.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand heat and perform reliably in challenging environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can function effectively even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position offers redundancy and enhances signal integrity, making this product reliable in critical applications.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for a compact overall design, making this product suitable for slim devices and applications with limited space.

Width (mm): 7.5 mm

The narrow width of 7.5mm enables efficient use of PCB real estate, contributing to space-saving and optimized circuit layouts.

Other IC type: ANALOG CIRCUIT

Featuring analog circuit capabilities, this product is versatile and can handle a wide range of input/output signals for diverse applications.

Minimum Supply Voltage (Vsup): 13.5 V

With a low minimum supply voltage of 13.5V, this product is energy-efficient and can operate on lower power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly, guaranteeing product reliability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without degrading performance.

Length: 10.3 mm

The length of 10.3mm provides a compact footprint, enabling the product to fit well within constrained spaces or layouts.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards and is reliable for a wide range of applications.

Maximum Supply Current (Isup): 4.5 mA

This product has a low maximum supply current of 4.5mA, making it suitable for low-power applications where energy efficiency is crucial.

Technology: BIPOLAR

Utilizing bipolar technology, this product offers high-speed performance, analog signal amplification, and precise control in various circuits.

Terminal Form: GULL WING

The gull wing terminal form ensures secure soldering connections, preventing solder joint fractures and ensuring long-term reliability.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for easy soldering and facilitates efficient PCB layout, enhancing the overall assembly process.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has moderate sensitivity to moisture exposure, making it suitable for standard storage and handling practices.

Maximum Supply Voltage (Vsup): 40 V

Capable of handling a maximum supply voltage of 40V, this product offers versatility and compatibility with various power sources.

Technical Specifications

Other Function Semiconductors XTR110KU/1KG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

4.5 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

XTR110KU/1KG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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