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XTR300AIRGWRG4

Texas Instruments

XTR300AIRGWRG4 by Texas Instruments

XTR300AIRGWRG4 by Texas Instruments is a 20V analog circuit IC with BICMOS technology. It features a square chip carrier package with 20 terminals and operates b/w -55 to 125 °C. Ideal for military applications, it supports supply voltages from -22V to 22V and has a compact size of 5x5mm for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,151 parts In-Stock

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8,151

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Chip Stock

USA . 6,940 parts In-Stock

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6,940

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Digiode

USA . 130 parts In-Stock

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130

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Nova Conductors

Japan . 54 parts In-Stock

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54

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One Stop Electronics

USA . 1,643 parts In-Stock

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$1.500

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1,643

$1.500

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Semicontronic

India . 1,247 parts In-Stock

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$3.500

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$3.412

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$3.395

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$3.500

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$3.395

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Parana Technologies

USA . 1,530 parts In-Stock

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$5.352

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$6.021

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1,530

$5.352

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$6.021

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ChromeModa Solutions

Germany . 1,491 parts In-Stock

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$6.013

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$4.931

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$6.013

$4.931

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IDEA Electronic Components Group

UK . 688 parts In-Stock

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$6.013

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$5.412

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688

$6.013

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$5.412

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Ampacity Inc.

Singapore . 1,095 parts In-Stock

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$7.500

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$7.500

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$18.477

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$17.553

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$17.553

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$18.477

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$17.553

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AZTECH Wire

Italy . 673 parts In-Stock

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$19.530

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Corohmni

South Africa . 101 parts In-Stock

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$22.520

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iodParts Technologies Inc.

India . 90,484 parts In-Stock

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Corphita

USA . 4,996 parts In-Stock

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Argo Parts USA

USA . 4,839 parts In-Stock

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DigiPath Technology Company

USA . 1,653 parts In-Stock

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$5.421

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$5.421

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Continental Prestige Electronics

USA . 1,550 parts In-Stock

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1,550

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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100

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Overview

Experience top-notch quality and reliability with the XTR300AIRGWRG4 by Texas Instruments. As a leading manufacturer in the semiconductor industry, this product offers unparalleled performance and precision. Whether you're looking for a solution in automation, industrial controls, or instrumentation, this versatile device provides exceptional value and benefits. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the XTR300AIRGWRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the semiconductor, ensuring reliability and durability.

Surface Mount: YES

Being surface mountable makes it easier to integrate this semiconductor into various electronic applications, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 20 V

Suitable supply voltage for a wide range of applications, providing flexibility in usage.

No. of Terminals: 20

Having a higher number of terminals allows for more connections and functionality in the semiconductor.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this semiconductor can withstand demanding environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in a variety of temperature settings without compromising performance.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Other Function Semiconductors XTR300AIRGWRG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Maximum Negative Supply Voltage (Vsup):

-22 V

Minimum Negative Supply Voltage (Vsup):

-5 V

Nominal Negative Supply Voltage (Vsup):

-20 V

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

XTR300AIRGWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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