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MP45DT02TR

STMicroelectronics

MP45DT02TR by STMicroelectronics

MP45DT02TR by STMicroelectronics is a low-profile grid array IC with 6 terminals, operating b/w -30°C to 85°C. It features a nominal voltage of 1.8V and CMOS technology, suitable for applications requiring analog circuit functionality in compact spaces.

Median Price

$1.049

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

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$1.049

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39

$1.049

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Chip Stock

USA . 104,120 parts In-Stock

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Vyrian

USA . 4,262 parts In-Stock

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4,262

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Cyclops Electronics Ltd

UK . 2,450 parts In-Stock

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2,450

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Digiode

USA . 2,162 parts In-Stock

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Inventory MP

USA . 1,381 parts In-Stock

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1,381

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Bristol Electronics

USA . 1,381 parts In-Stock

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1,381

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Anansix

USA . 647 parts In-Stock

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647

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ACDS - Activité Composants Distribution Service

France . 372 parts In-Stock

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372

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Distributors (Availability)

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$1.049

100+ parts

$0.997

1k+ parts

$0.947

10k+ parts

$0.934

50

$1.049

$0.997

$0.947

$0.934

Argo Parts USA

USA . 2,930 parts In-Stock

1+ parts

$1.049

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2,930

$1.049

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Continental Prestige Electronics

USA . 2,146 parts In-Stock

1+ parts

$1.049

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$1.028

2,146

$1.049

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$1.028

IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$2.301

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$2.071

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527

$2.301

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$2.071

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Aztec Data Supply Inc.

USA . 162 parts In-Stock

1+ parts

$2.810

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162

$2.810

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MKK Technologies

India . 650 parts In-Stock

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$4.327

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650

$4.327

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DigiPath Technology Company

USA . 650 parts In-Stock

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$4.327

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650

$4.327

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Semicontronic

India . 1,589 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,589

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 922 parts In-Stock

1+ parts

$5.500

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922

$5.500

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AZTECH Wire

Italy . 246 parts In-Stock

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$6.306

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246

$6.306

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Corohmni

South Africa . 248 parts In-Stock

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$19.219

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248

$19.219

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$22.519

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$21.393

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$21.393

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1,000

$22.519

$21.393

$21.393

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Assy Fe

Spain . 364,508 parts In-Stock

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RC Electronics

USA . 44,866 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,021 parts In-Stock

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Metaverse IC Inc.

Canada . 16,657 parts In-Stock

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Perfect Parts

USA . 14,624 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,010 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Kepictronics

USA . 4,140 parts In-Stock

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Lixinc

USA . 2,606 parts In-Stock

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Corphita

USA . 628 parts In-Stock

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628

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Cyclops Electronics Ltd (Excess)

UK . 372 parts In-Stock

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372

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Glotronic Ltd.

UK . 298 parts In-Stock

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298

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Parana Technologies

USA . 228 parts In-Stock

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$2.751

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228

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$2.751

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Overview

Discover the cutting-edge MP45DT02TR by STMicroelectronics, a top-tier manufacturer known for its superior quality and innovation in semiconductors. This versatile product falls under the category of Other Function Semiconductors, offering a wide range of applications. With a nominal supply voltage of 1.8V and a compact rectangular package shape, this device is perfect for various electronic projects. Experience the value and benefits of this product, designed to provide reliable performance and efficiency to customers seeking advanced solutions in analog circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the semiconductor components inside, making it durable and long-lasting.

Surface Mount: YES

Being surface mountable makes it easy to integrate this component into circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards and helps optimize space utilization.

Nominal Supply Voltage (Vsup): 1.8 V

The low nominal supply voltage helps in reducing power consumption, making it suitable for battery-operated devices.

No. of Terminals: 6

With 6 terminals, this component offers flexibility in connecting to other components or circuitry.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style allows for high-density mounting, saving valuable board space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

The wide temperature range makes this component suitable for use in both cold and hot environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and facilitates easier routing of traces.

Maximum Seated Height: 1.375 mm

The low profile design with a maximum seated height of 1.375 mm allows for more compact and slim devices.

Width (mm): 3.76 mm

The narrow width of 3.76 mm enables placement in tight spaces on the circuit board.

Other IC type: ANALOG CIRCUIT

The analog circuit type allows for precise signal processing, making it ideal for applications where accurate analog signal handling is required.

Minimum Supply Voltage (Vsup): 1.64 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 4.72 mm

The compact length of 4.72 mm saves board space and enables sleek and slim device designs.

Technology: CMOS

The CMOS technology offers low power consumption and high speed, making it suitable for various digital applications.

Terminal Form: BUTT

The butt terminal form simplifies soldering and ensures a secure connection for reliable performance.

Terminal Pitch: 1.65 mm

The standard terminal pitch of 1.65 mm allows for easy integration into standard PCB layouts.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage provides flexibility in power supply options for different applications.

Technical Specifications

Other Function Semiconductors MP45DT02TR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B6

Length:

4.72 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.375 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.64 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

1.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.76 mm

Trade Compliance

MP45DT02TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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