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XTR300AIRGWR

Texas Instruments

XTR300AIRGWR by Texas Instruments

XTR300AIRGWR by Texas Instruments is a BICMOS analog circuit with 2 channels. It operates at a temperature range of -55 to 125 °C and has a supply voltage range of -22 to 40 V. This chip carrier package is suitable for military applications.

Median Price

$3.372

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$1.102

100+ parts

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1

$1.102

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Chip1Stop

Japan . 1 parts In-Stock

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$3.020

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$3.020

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Texas Instruments

USA . 1,137,261 parts In-Stock

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$3.723

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$3.262

1k+ parts

$1.843

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1,137,261

$3.723

$3.262

$1.843

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Mouser Electronics

USA . 1,932 parts In-Stock

1+ parts

$5.710

100+ parts

$3.840

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-

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$3.270

1,932

$5.710

$3.840

-

$3.270

DigiKey

USA . 3,627 parts In-Stock

1+ parts

$5.790

100+ parts

$3.714

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$3.566

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3,627

$5.790

$3.714

$3.566

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Verical

USA . 29 parts In-Stock

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$2.416

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29

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$2.416

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Distributors (In-Stock)

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Digiode

USA . 2,382 parts In-Stock

1+ parts

$2.245

100+ parts

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2,382

$2.245

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Nova Conductors

Japan . 100 parts In-Stock

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$2.764

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$2.764

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EXC GmbH

Germany . 3,000 parts In-Stock

1+ parts

$5.210

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3,000

$5.210

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Vyrian

USA . 190,397 parts In-Stock

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190,397

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Cyclops Electronics Ltd

UK . 13,727 parts In-Stock

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Chip Stock

USA . 7,020 parts In-Stock

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Sensible Micro Corp

USA . 3,000 parts In-Stock

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Semtec, LLC

USA . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 492 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

$2.272

10k+ parts

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492

$1.663

-

$2.272

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DigiPath Technology Company

USA . 2,029 parts In-Stock

1+ parts

$1.832

100+ parts

$1.685

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2,029

$1.832

$1.685

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ChromeModa Solutions

Germany . 5,966 parts In-Stock

1+ parts

$1.869

100+ parts

$1.533

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5,966

$1.869

$1.533

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$1.869

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$1.682

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1,406

$1.869

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$1.682

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Ampacity Inc.

Singapore . 190,104 parts In-Stock

1+ parts

$2.010

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190,104

$2.010

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Semicontronic

India . 190,015 parts In-Stock

1+ parts

$2.010

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$1.960

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$1.950

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190,015

$2.010

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$1.950

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Corphita

USA . 1,895 parts In-Stock

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$2.127

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$2.127

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Argo Parts USA

USA . 4,525 parts In-Stock

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$2.764

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$2.764

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Continental Prestige Electronics

USA . 1,211 parts In-Stock

1+ parts

$2.764

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$2.709

1,211

$2.764

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$2.709

Corohmni

South Africa . 1,020 parts In-Stock

1+ parts

$2.949

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$2.949

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$3.037

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$2.886

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$2.886

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$3.037

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$2.886

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Modulus Dynamics

Lithuania . 900 parts In-Stock

1+ parts

$3.069

100+ parts

$3.038

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$2.946

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900

$3.069

$3.038

$2.946

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iodParts Technologies Inc.

India . 90,484 parts In-Stock

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Perfect Parts

USA . 50,512 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,993 parts In-Stock

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Kepictronics

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Technoshack Inc. (Excess)

Canada . 4,800 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Lixinc

USA . 2,353 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$2.709

1k+ parts

$2.626

10k+ parts

$2.571

500

-

$2.709

$2.626

$2.571

Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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$0.126

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$0.126

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$0.126

350

-

$0.126

$0.126

$0.126

Lucentia Tech

USA . 350 parts In-Stock

1+ parts

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$0.126

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$0.126

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$0.126

350

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$0.126

$0.126

$0.126

S.R.D Solutions

India . 100 parts In-Stock

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100

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Overview

Experience the next level of performance and precision with the XTR300AIRGWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings unmatched quality and reliability to every product they create. The XTR300AIRGWR is a game-changer in the field of Other Function Semiconductors, offering a range of applications that will revolutionize your projects. With its advanced technology and innovative design, this chip carrier with a very thin profile provides exceptional value and benefits to customers. Whether you're working on military-grade projects or require precise analog circuits, the XTR300AIRGWR delivers superior results. Discover the advantages of Texas Instruments and unlock the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, making it resistant to damage and suitable for various applications.

Surface Mount: YES

With its surface mount capability, this product can be easily and securely attached to circuit boards, saving space and allowing for efficient assembly.

No. of Functions: 1

This product offers a single function, simplifying design and reducing complexity in applications.

Package Shape: SQUARE

The square package shape of this product allows for easy placement and alignment, making it convenient for manufacturing processes.

Nominal Supply Voltage (Vsup): 20 V

This product operates reliably at a nominal supply voltage of 20 V, providing stable and consistent performance.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options, ensuring compatibility with a wide range of systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier and heat sink/slug package style of this product allows for efficient heat dissipation, ensuring reliable operation in demanding conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

The ability to operate reliably at extremely low temperatures of -55°C makes this product suitable for use in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance and durability.

Terminal Position: QUAD

The quad terminal position of this product allows for easy connectivity and integration into multi-channel systems.

Maximum Seated Height: 1 mm

With a maximum seated height of only 1 mm, this product offers a compact and space-saving solution for applications with size constraints.

Width (mm): 5 mm

The 5 mm width of this product makes it suitable for use in narrow spaces, where compactness is essential.

Other IC type: ANALOG CIRCUIT

This product is an analog circuit, making it ideal for applications that require accurate and precise analog signal processing.

Minimum Supply Voltage (Vsup): 10 V

With a minimum supply voltage of 10 V, this product can operate at lower power levels, resulting in energy efficiency.

Minimum Negative Supply Voltage (Vsup): -5 V

The ability to operate with a minimum negative supply voltage of -5 V allows for versatility in power supply options for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperature for up to 30 seconds, ensuring proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can endure high-temperature soldering processes, guaranteeing reliable and robust connections.

Length: 5 mm

The compact length of 5 mm makes this product suitable for space-constrained applications where size is crucial.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets the stringent requirements for reliability and performance in extreme temperature and environmental conditions.

No. of Channels: 2

With two channels, this product offers versatility and flexibility in signal processing and transmission, making it suitable for stereo or dual-channel applications.

Technology: BICMOS

This product utilizes BICMOS (Bipolar Complementary Metal-Oxide-Semiconductor) technology, combining the advantages of both bipolar and CMOS technologies for improved performance and efficiency.

Terminal Form: NO LEAD

The no-lead terminal form of this product offers better thermal conductivity and ease of manufacturing, ensuring smooth soldering and enhancing overall reliability.

Maximum Negative Supply Voltage (Vsup): -22 V

With a maximum negative supply voltage of -22 V, this product can accommodate a wider range of power supply options, providing flexibility in system design.

Nominal Negative Supply Voltage (Vsup): -20 V

The nominal negative supply voltage of -20 V ensures stable and consistent performance, making this product suitable for various power supply configurations.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product allows for precise and accurate connections, ensuring secure and reliable electrical contact.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that this product has a moderate sensitivity to moisture, requiring standard handling and storage precautions.

Maximum Supply Voltage (Vsup): 40 V

With a maximum supply voltage of 40 V, this product can handle high-power applications, providing sufficient headroom and voltage range for reliable operation.

Technical Specifications

Other Function Semiconductors XTR300AIRGWR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Maximum Negative Supply Voltage (Vsup):

-22 V

Minimum Negative Supply Voltage (Vsup):

-5 V

Nominal Negative Supply Voltage (Vsup):

-20 V

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

XTR300AIRGWR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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