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LSM320HAY30TR

STMicroelectronics

LSM320HAY30TR by STMicroelectronics

LSM320HAY30TR by STMicroelectronics is a versatile analog circuit IC designed for industrial applications. It operates within a supply voltage range of 2.7V to 3.6V and withstands temperatures from -40 °C to 85 °C. This surface-mount device features a compact grid array with 28 terminals, ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,800 parts In-Stock

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3,800

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Anansix

USA . 2,256 parts In-Stock

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2,256

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Digiode

USA . 1,457 parts In-Stock

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1,457

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,049 parts In-Stock

1+ parts

$13.012

100+ parts

-

1k+ parts

$11.711

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2,049

$13.012

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$11.711

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MKK Technologies

India . 696 parts In-Stock

1+ parts

$24.469

100+ parts

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696

$24.469

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DigiPath Technology Company

USA . 696 parts In-Stock

1+ parts

$24.469

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696

$24.469

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Corphita

USA . 4,560 parts In-Stock

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4,560

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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ChipstoGo Electronic ltd

UK . 172 parts In-Stock

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172

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Parana Technologies

USA . 142 parts In-Stock

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$15.558

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142

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$15.558

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Overview

Unlock the potential of your next project with the LSM320HAY30TR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile and robust device excels in diverse applications, ensuring exceptional performance even in challenging environments. With its compact design and industrial-grade reliability, it stands ready to enhance your products while delivering impressive power efficiency. Trust STMicroelectronics for unparalleled quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a robust and durable enclosure, ensuring protection against environmental impacts.

Surface Mount: YES

Surface mount technology enables efficient space utilization on PCBs, making this product ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy alignment and placement on circuit boards, contributing to overall design efficiency.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal voltage of 3V makes this device compatible with a wide range of electronics, ensuring versatile application.

Power Supplies (V): 3

The specification aligns with standard power supply levels, facilitating integration into various systems without complex voltage management.

No. of Terminals: 28

A higher number of terminals (28) allows for more functionalities and connections, enhancing the performance of circuit designs.

Package Style (Meter): GRID ARRAY

The grid array packaging style optimizes heat dissipation and improves electrical performance, making it suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications, ensuring reliability under challenging conditions.

Minimum Operating Temperature: -40 °C

Operating efficiently at -40 °C enables use in extreme environments, expanding application possibilities across varied industries.

Terminal Finish: NICKEL GOLD

Nickel-gold terminal finishes provide excellent corrosion resistance and conductivity, ensuring long-term reliability and performance.

Terminal Position: BOTTOM

Bottom terminal positioning enhances PCB layout flexibility and minimizes surface area for better performance.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm allows for slim designs, making this product a perfect fit for space-constrained applications.

Width: 4.4 mm

The compact width of 4.4 mm maximizes design efficiency and allows for high-density layouts in modern electronics.

Other IC type: ANALOG CIRCUIT

Being classified as an analog circuit IC, this component is suitable for signal processing applications, enhancing versatility.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7V allows for extended functionality in battery-operated devices, improving energy efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

Withstanding a peak reflow time of 30 seconds ensures adaptability to various assembly processes, enhancing manufacturing flexibility.

Peak Reflow Temperature: 260 °C

A peak reflow temperature tolerance of 260 °C allows the product to endure high-temperature soldering processes, essential for reliability.

Length: 7.5 mm

The length of 7.5 mm is optimized for balancing performance with space savings, ideal for modern, compact electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees performance reliability and longevity in demanding environments and applications.

Terminal Form: BUTT

Butt terminals facilitate improved mechanical connections and reliable soldering, enhancing overall product robustness.

Terminal Pitch: 0.6 mm

A terminal pitch of 0.6 mm allows for high-density pin configurations, which is vital for complex circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the device can handle moderate moisture exposure, allowing for flexible storage and handling options.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V offers additional flexibility in circuit design, catering to a range of power requirements.

Technical Specifications

Other Function Semiconductors LSM320HAY30TR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B28

JESD-609 Code:

e4

Length:

7.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.18X.3,24

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.6 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LSM320HAY30TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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