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LSM303DLH

STMicroelectronics

LSM303DLH by STMicroelectronics

LSM303DLH by STMicroelectronics is a CMOS analog circuit with 28 terminals, operating b/w -30 to 85°C. It has a supply voltage range of 2.5-3.3V and peak reflow temperature of 260°C. This sensor is suitable for applications requiring precise orientation sensing in compact electronic devices.

Median Price

$7.006

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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$7.006

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Anansix

USA . 2,486 parts In-Stock

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R&J Components

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Vyrian

USA . 2,168 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,666 parts In-Stock

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Digiode

USA . 1,372 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 490 parts In-Stock

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Avant Electronics Limited

UK . 316 parts In-Stock

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J2 Sourcing AB

Sweden . 100 parts In-Stock

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Semi Source

USA . 51 parts In-Stock

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Prism Electronics

USA . 45 parts In-Stock

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Bristol Electronics

USA . 7 parts In-Stock

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Atlantic Semiconductor

USA . 7 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 27 parts In-Stock

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$5.381

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AZTECH Wire

Italy . 325 parts In-Stock

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$6.224

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Ampacity Inc.

Singapore . 336 parts In-Stock

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$6.500

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Continental Prestige Electronics

USA . 4,636 parts In-Stock

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$6.866

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Netroflash

USA . 50 parts In-Stock

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$7.006

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$6.656

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$6.516

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$6.516

IDEA Electronic Components Group

UK . 281 parts In-Stock

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$7.107

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$6.396

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Semicontronic

India . 1,105 parts In-Stock

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$7.312

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$7.275

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MKK Technologies

India . 1,647 parts In-Stock

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$13.364

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DigiPath Technology Company

USA . 1,647 parts In-Stock

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Aztec Data Supply Inc.

USA . 377 parts In-Stock

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RC Electronics

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A-Z Elektronik GmbH

Germany . 7,652 parts In-Stock

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Lixinc

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Corphita

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Authorized Procurement Solutions

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Argo Parts USA

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Parana Technologies

USA . 2,032 parts In-Stock

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Metaverse IC Inc.

Canada . 190 parts In-Stock

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Kepictronics

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Overview

Unlock a world of possibilities with the LSM303DLH by STMicroelectronics. This innovative sensor offers unparalleled quality and reliability, backed by the trusted manufacturer, STMicroelectronics. Designed for a variety of applications in the category of Other Function Semiconductors, this product provides customers with exceptional value and benefits. Experience precise measurements and seamless integration with the LSM303DLH, setting new standards in performance and efficiency. Elevate your projects with this cutting-edge sensor today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the semiconductor, making it suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving space and minimizing assembly time.

Nominal Supply Voltage (Vsup): 2.5 V

Operates effectively at a low voltage, which can result in energy efficiency and reduced power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable and stable performance under demanding conditions.

Technology: CMOS

Uses CMOS technology, known for its low power consumption, high noise immunity, and compatibility with various digital and analog applications.

Maximum Supply Voltage (Vsup): 3.3 V

Supports a higher supply voltage when needed, providing flexibility for different power requirements.

Technical Specifications

Other Function Semiconductors LSM303DLH attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,22

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.55 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

LSM303DLH Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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