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LIS3MDL

STMicroelectronics

LIS3MDL by STMicroelectronics

LIS3MDL by STMicroelectronics is a square-shaped, surface-mountable sensor with 12 terminals. It operates in an industrial temperature range of -40 to 85°C and has a very thin profile of 1mm. This analog circuit is commonly used for magnetic field sensing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 19,500 parts In-Stock

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19,500

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Component Sense

UK . 5,327 parts In-Stock

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5,327

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Digiode

USA . 3,841 parts In-Stock

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Vyrian

USA . 3,380 parts In-Stock

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3,380

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Anansix

USA . 993 parts In-Stock

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993

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,277 parts In-Stock

1+ parts

$2.150

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2,277

$2.150

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$2.491

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$2.366

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$2.366

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200

$2.491

$2.366

$2.366

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Semicontronic

India . 1,227 parts In-Stock

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$2.500

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$2.438

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$2.425

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1,227

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,172 parts In-Stock

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$2.500

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$2.500

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Corohmni

South Africa . 800 parts In-Stock

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$2.834

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800

$2.834

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AZTECH Wire

Italy . 868 parts In-Stock

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$12.711

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868

$12.711

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

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$19.000

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$17.100

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$17.100

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MKK Technologies

India . 404 parts In-Stock

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$35.728

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404

$35.728

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DigiPath Technology Company

USA . 404 parts In-Stock

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$35.728

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$35.728

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A-Z Elektronik GmbH

Germany . 5,889 parts In-Stock

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Lixinc

USA . 5,359 parts In-Stock

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Argo Parts USA

USA . 4,060 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,926 parts In-Stock

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Continental Prestige Electronics

USA . 3,113 parts In-Stock

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Corphita

USA . 1,697 parts In-Stock

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1,697

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Parana Technologies

USA . 332 parts In-Stock

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$22.717

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332

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$22.717

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the LIS3MDL by STMicroelectronics, a high-quality semiconductor that offers endless possibilities. With its state-of-the-art manufacturing process and industry-leading expertise, STMicroelectronics guarantees reliability and performance. This versatile sensor is perfect for various applications, from consumer electronics to industrial automation. Experience the value of precise measurements, enhanced efficiency, and unparalleled accuracy. Don't miss out on the advantages this exceptional product brings to your projects. Choose the LIS3MDL and unlock a world of opportunities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, ensuring its reliability and longevity.

Surface Mount: YES

The surface mount feature allows for easy assembly and integration, making it convenient for various applications.

Package Shape: SQUARE

The square shape of the package provides stability and ease of handling during installation or replacement.

Nominal Supply Voltage (Vsup): 2.5V

With a nominal supply voltage of 2.5V, this product offers a suitable power range for efficient operation.

No. of Terminals: 12

The abundance of terminals allows for a versatile range of connections, enhancing the product's flexibility in different circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, along with a very thin profile and fine pitch, facilitates space-saving integration while maintaining high-performance capabilities.

Maximum Operating Temperature: 85 °C

This product can withstand high operating temperatures up to 85°C, ensuring reliability in demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product remains functional even in extremely cold conditions.

Terminal Position: BOTTOM

The bottom terminal position allows for convenient board placement and streamlined connections.

Maximum Seated Height: 1mm

The maximum seated height of 1mm ensures minimal space consumption, enabling compact device designs.

Width (mm): 2mm

The 2mm width of this product promotes slim and space-efficient circuit layouts.

Other IC type: ANALOG CIRCUIT

This product belongs to the category of analog circuits, providing precise and accurate processing of signals.

Minimum Supply Voltage (Vsup): 1.9V

With a minimum supply voltage of 1.9V, this product offers a wide operating range, suitable for various applications.

Length: 2mm

The compact length of 2mm enhances the product's suitability for compact and portable electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets the rigorous temperature and performance requirements of industrial environments.

Terminal Form: BUTT

The butt terminal form ensures secure and reliable connections, preventing potential signal loss or interruption.

Terminal Pitch: 0.5mm

The terminal pitch of 0.5mm facilitates high-density interconnections, enabling advanced circuit designs and compact layouts.

Maximum Supply Voltage (Vsup): 3.6V

This product supports a maximum supply voltage of 3.6V, allowing for a wide range of power options to suit diverse applications.

Technical Specifications

Other Function Semiconductors LIS3MDL attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B12

Length:

2 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.9 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2 mm

Trade Compliance

LIS3MDL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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