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LIS331DL

STMicroelectronics

LIS331DL by STMicroelectronics

STMicroelectronics' LIS331DL is a motion sensor IC with 16 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.16-3.6V and peak reflow temp of 260°C. Ideal for industrial applications requiring precise motion detection in compact spaces.

Median Price

$9.408

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 16,500 parts In-Stock

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Vyrian

USA . 3,396 parts In-Stock

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Digiode

USA . 2,102 parts In-Stock

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Anansix

USA . 1,881 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,724 parts In-Stock

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ComSIT USA

USA . 1,724 parts In-Stock

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J2 Sourcing AB

Sweden . 1,026 parts In-Stock

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Classic Components Corporation

USA . 910 parts In-Stock

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910

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Nova Conductors

Japan . 750 parts In-Stock

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750

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ACDS - Activité Composants Distribution Service

France . 357 parts In-Stock

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Prism Electronics

USA . 100 parts In-Stock

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Micros

Poland . 83 parts In-Stock

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$9.408

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Partservice

France . 83 parts In-Stock

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$8.646

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$8.646

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$8.646

83

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$8.646

$8.646

$8.646

Micros sp.j. W. Kędra i J. Lic

Poland . 83 parts In-Stock

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$9.262

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$9.262

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$9.262

83

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$9.262

Elcom Components

USA . 1 parts In-Stock

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Semicontronic

India . 377 parts In-Stock

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$0.500

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$0.488

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$0.485

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377

$0.500

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Corohmni

South Africa . 562 parts In-Stock

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$1.174

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$1.174

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Ampacity Inc.

Singapore . 1,029 parts In-Stock

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$4.500

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$4.500

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Aztec Data Supply Inc.

USA . 2,394 parts In-Stock

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$6.220

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AZTECH Wire

Italy . 202 parts In-Stock

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$8.625

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

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$20.510

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$18.459

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MKK Technologies

India . 1,857 parts In-Stock

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$38.567

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DigiPath Technology Company

USA . 1,857 parts In-Stock

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$38.567

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Lixinc

USA . 11,095 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,641 parts In-Stock

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Continental Prestige Electronics

USA . 4,970 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,427 parts In-Stock

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Argo Parts USA

USA . 3,941 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,279 parts In-Stock

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Parana Technologies

USA . 1,658 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 545 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 357 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the LIS331DL from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers quality products that exceed expectations. The LIS331DL is a versatile motion sensor that offers precise and reliable performance for a wide range of applications. With its compact design and innovative technology, this sensor provides value and benefits to customers looking to enhance their products with advanced motion-sensing capabilities. Trust STMicroelectronics to deliver cutting-edge solutions for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability makes it easy to integrate this component onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 2.5 V

The nominal supply voltage of 2.5V is common and compatible with many other electronic components, making integration easier.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in various industrial settings without risking overheating.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with various digital systems.

Technical Specifications

Other Function Semiconductors LIS331DL attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LIS331DL Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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