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PCF8591TD

NXP Semiconductors

PCF8591TD by NXP Semiconductors

PCF8591TD by NXP Semiconductors is a small outline, surface mount IC with 16 terminals. It operates at a supply voltage range of 2.5V to 6V and has an industrial temperature grade of -40°C to 85°C. This analog circuit is commonly used in various applications requiring precise measurements and control.

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Vyrian

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Digiode

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Anansix

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Connector Distribution Corp

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Right Parts Inc.

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Bristol Electronics

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Nova Conductors

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 144 parts In-Stock

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PC Components Company LLC

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Atlantic Semiconductor

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R&J Components

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QIE Inc.

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NPI Materials, Inc.

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Sea View Technologies

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Lantek

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Semicontronic

India . 978 parts In-Stock

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$0.500

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$0.488

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Ampacity Inc.

Singapore . 894 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

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Advanced Electronics

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Corohmni

South Africa . 52 parts In-Stock

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AZTECH Wire

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Overview

Discover the PCF8591TD by NXP Semiconductors, an exceptional product that delivers unparalleled quality and performance. As a leading manufacturer in the industry, NXP Semiconductors has a proven track record of producing superior electronic components. The PCF8591TD falls into the category of Other Function Semiconductors and offers a wide range of applications. With its compact size and advanced technology, this product provides customers with incredible value and numerous benefits. Explore new possibilities and unlock the potential of your projects with the PCF8591TD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the semiconductor, making it suitable for various industrial applications.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a standard voltage level, ensuring compatibility with common power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for use in industrial environments where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance and reliability of the semiconductor.

Technical Specifications

Other Function Semiconductors PCF8591TD attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.5 mm

Trade Compliance

PCF8591TD Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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