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PCF8591P

NXP Semiconductors

PCF8591P by NXP Semiconductors

PCF8591P by NXP Semiconductors is an ANALOG CIRCUIT IC with 16 terminals, operating at -40 to 85 °C. It has a supply voltage range of 2.5V to 6V and comes in a PLASTIC/EPOXY package style. Ideal for industrial applications requiring precise analog signal processing.

Median Price

$2.154

Lifecycle Status

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Nova Conductors

Japan . 50 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

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Resion

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ComSIT Distribution GmbH

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Corel Iberica Componentes, S.L.

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Component Electronics Inc.

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Sunrise Surplus Inc.

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LIBRA Elektronik GmbH

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Bastille Electronics

Australia . 1,000 parts In-Stock

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$2.046

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$1.944

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$1.917

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$1.917

Continental Prestige Electronics

USA . 3,830 parts In-Stock

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Argo Parts USA

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Semicontronic

India . 855 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Modulus Dynamics

Lithuania . 3,566 parts In-Stock

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Microchip USA

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Corohmni

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Aztec Data Supply Inc.

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Overview

Unlock endless possibilities with the PCF8591P by NXP Semiconductors, a versatile analog circuit semiconductor that offers unparalleled quality and reliability. Ideal for industrial applications, this innovative product features a wide operating temperature range and a compact design for seamless integration. With its nickel palladium gold terminal finish and dual terminal position, the PCF8591P guarantees optimal performance and efficiency. Experience the value and benefits of this exceptional semiconductor, designed to exceed your expectations and enhance your projects like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, making it a reliable choice.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices, offering versatility in design.

Nominal Supply Voltage (Vsup): 5 V

With a stable supply voltage, this semiconductor ensures consistent performance and reliability in operation.

No. of Terminals: 16

The high number of terminals enables a complex connection setup, making this product suitable for advanced circuit designs.

Package Style (Meter): IN-LINE

The in-line package style makes it convenient for installation and maintenance, ideal for tight spaces.

Maximum Operating Temperature: 85 °C

This high operating temperature range ensures the semiconductor can withstand harsh environmental conditions, enhancing its durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments, making it versatile and adaptable.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connection options, making this semiconductor adaptable to various circuit layouts.

Maximum Seated Height: 4.7 mm

The low seated height offers space-saving benefits and allows for compact device designs.

Width (mm): 7.62 mm

The narrow width makes this semiconductor suitable for applications where space is limited, offering flexibility in design.

Other IC type: ANALOG CIRCUIT

The analog circuit type allows for precise signal processing, making this product ideal for applications requiring accurate analog data handling.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage enables energy-efficient operation, making this semiconductor suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time requirement simplifies the manufacturing process, reducing production time and costs.

Peak Reflow Temperature °C: 260

This high peak reflow temperature tolerance ensures reliable soldering connections, enhancing the overall quality of the product.

Length: 19.025 mm

The moderate length of this semiconductor allows for integration into a variety of electronic devices, offering flexibility in design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions, making this semiconductor suitable for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this semiconductor energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust connections, making this semiconductor suitable for applications where durability is essential.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy integration into existing circuit designs, offering compatibility and versatility.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage tolerance provides flexibility in power input options, making this semiconductor suitable for a wide range of applications.

Technical Specifications

Other Function Semiconductors PCF8591P attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.025 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

PCF8591P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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