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PCF8591TD-T

NXP Semiconductors

PCF8591TD-T by NXP Semiconductors

PCF8591TD-T by NXP Semiconductors is a 16-terminal IC with supply voltage range of 2.5V to 6V, operating from -40°C to 85°C. It's an analog circuit in small outline package for industrial applications requiring CMOS technology and surface mount compatibility.

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Digiode

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Anansix

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Vyrian

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M&R Communications

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Resion

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Inventory MP

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J2 Sourcing AB

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Nova Conductors

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Bristol Electronics

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Prism Electronics

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Semicontronic

India . 483 parts In-Stock

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$0.488

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One Stop Electronics

USA . 970 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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Ampacity Inc.

Singapore . 550 parts In-Stock

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AZTECH Wire

Italy . 494 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,861 parts In-Stock

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Corphita

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Argo Parts USA

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iodParts Technologies Inc.

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Bastille Electronics

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Overview

Unlock the full potential of your electronics projects with the PCF8591TD-T by NXP Semiconductors. This high-quality analog circuit offers unparalleled versatility and precision, making it ideal for a wide range of applications. With a robust design and industrial-grade temperature tolerance, this small-outline package delivers reliability and performance that you can trust. Experience the value and benefits of NXP Semiconductors' cutting-edge technology with the PCF8591TD-T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage level that is widely compatible with many systems and components.

Temperature Grade: INDUSTRIAL

Designed to operate efficiently in industrial environments, making it a reliable choice for industrial applications.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function Semiconductors PCF8591TD-T attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.5 mm

Trade Compliance

PCF8591TD-T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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