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LIS302DLTR8

STMicroelectronics

LIS302DLTR8 by STMicroelectronics

LIS302DLTR8 by STMicroelectronics is a CMOS analog circuit with 14 terminals in a rectangular package. It operates b/w -40 to 85 °C and has a supply voltage range of 2.16V to 3.6V, making it ideal for industrial applications requiring precise motion sensing capabilities. The package style is grid array with very thin profile and fine pitch, suitable for surface mount assembly processes.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 86,553 parts In-Stock

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Cyclops Electronics Ltd

UK . 39,870 parts In-Stock

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Anansix

USA . 1,622 parts In-Stock

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Vyrian

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Prism Electronics

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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Semicontronic

India . 363 parts In-Stock

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$1.500

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$1.462

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$1.455

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363

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

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$1.520

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$1.368

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Corohmni

South Africa . 66 parts In-Stock

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$2.239

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MKK Technologies

India . 1,653 parts In-Stock

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$2.858

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DigiPath Technology Company

USA . 1,653 parts In-Stock

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$2.858

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Ampacity Inc.

Singapore . 1,149 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 462 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,718 parts In-Stock

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Assy Fe

Spain . 56,980 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 6,209 parts In-Stock

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Continental Prestige Electronics

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Alle Elektronik GmbH

Germany . 4,139 parts In-Stock

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Corphita

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Argo Parts USA

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S.R.D Solutions

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Parana Technologies

USA . 2,068 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your projects with the LIS302DLTR8 by STMicroelectronics, a top-of-the-line analog circuit that promises unmatched quality and reliability. Manufactured by industry leader STMicroelectronics, this versatile semiconductor offers a wide range of applications in various industries. With its innovative design and cutting-edge technology, the LIS302DLTR8 stands out for its exceptional value and benefits, providing customers with unparalleled performance and precision. Experience the advantages of this product and take your projects to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

This product can be easily mounted on a circuit board, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5 V supply voltage requirement ensures compatibility with a wide range of power sources, increasing flexibility in application.

Power Supplies (V): 2.5

With a power supply of 2.5 V, this product offers energy-efficient operation, reducing power consumption and heat dissipation.

No. of Terminals: 14

The 14 terminals provide ample connectivity options, allowing for versatile integration into various circuit configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch enhances signal integrity and reduces electromagnetic interference.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this product to function in extreme cold climates, expanding its usability range.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and enhances solderability, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, optimizing signal paths and improving overall circuit performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a slim profile design, ideal for space-constrained applications.

Width (mm): 3 mm

The compact width of 3 mm enables close placement of components on the board, contributing to efficient board layout.

Other IC type: ANALOG CIRCUIT

This product, being an analog circuit, is capable of processing continuous data signals accurately, making it suitable for sensor interfaces and control systems.

Minimum Supply Voltage (Vsup): 2.16 V

The 2.16 V minimum supply voltage requirement allows for operation in low-power scenarios, increasing efficiency and extending battery life.

Length: 5 mm

The short length of 5 mm saves space on the board, enabling a more compact overall design for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding operating conditions, making this product suitable for rugged environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BUTT

The butt terminal form simplifies the assembly process and enhances signal transmission reliability, ensuring consistent performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density packaging on the PCB, enabling more functionality in a limited space.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6 V maximum supply voltage capability accommodates a wide range of power sources, enhancing compatibility with different systems.

Technical Specifications

Other Function Semiconductors LIS302DLTR8 attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B14

JESD-609 Code:

e3

Length:

5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LGA14,3X6,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

BUTT

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width (mm):

3 mm

Trade Compliance

LIS302DLTR8 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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