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LIS331DLF

STMicroelectronics

LIS331DLF by STMicroelectronics

LIS331DLF by STMicroelectronics is a 16-terminal chip carrier with a supply voltage range of 2.16V to 3.6V, operating from -40°C to 85°C. It's an analog circuit IC suitable for industrial applications, featuring a compact square package shape and surface-mount capability for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,445 parts In-Stock

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5,445

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Digiode

USA . 2,879 parts In-Stock

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2,879

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Anansix

USA . 1,730 parts In-Stock

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1,730

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Cyclops Electronics Ltd

UK . 546 parts In-Stock

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546

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Euro-Tech

UK . 373 parts In-Stock

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373

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,722 parts In-Stock

1+ parts

$3.200

100+ parts

-

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1,722

$3.200

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IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$3.921

100+ parts

-

1k+ parts

$3.529

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919

$3.921

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$3.529

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AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$5.800

100+ parts

-

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250

$5.800

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Ampacity Inc.

Singapore . 592 parts In-Stock

1+ parts

$6.500

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592

$6.500

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Corohmni

South Africa . 61 parts In-Stock

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$7.204

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61

$7.204

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MKK Technologies

India . 1,537 parts In-Stock

1+ parts

$7.373

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1,537

$7.373

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DigiPath Technology Company

USA . 1,537 parts In-Stock

1+ parts

$7.373

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1,537

$7.373

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Lixinc

USA . 14,371 parts In-Stock

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14,371

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A-Z Elektronik GmbH

Germany . 7,115 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,743 parts In-Stock

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4,743

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Corphita

USA . 4,363 parts In-Stock

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4,363

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Aranea Global

USA . 2,000 parts In-Stock

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RC Electronics

USA . 1,100 parts In-Stock

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Kepictronics

USA . 546 parts In-Stock

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546

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Argo Parts USA

USA . 383 parts In-Stock

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383

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Continental Prestige Electronics

USA . 216 parts In-Stock

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216

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Parana Technologies

USA . 42 parts In-Stock

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$4.688

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42

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$4.688

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Assy Fe

Spain . 5 parts In-Stock

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5

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Overview

Enhance your projects with the LIS331DLF by STMicroelectronics, a top-of-the-line Other Function Semiconductor that guarantees superior quality and reliability. Manufactured by industry leader STMicroelectronics, this sensor offers endless possibilities in various applications. With a package body material made of PLASTIC/EPOXY and a compact SQUARE shape, this chip carrier delivers unmatched performance. Whether you're working on industrial automation, robotics, or IoT devices, the LIS331DLF provides precise measurements and seamless integration. Elevate your designs today with this cutting-edge sensor and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, making it a reliable choice.

Surface Mount: YES

The surface mount option allows for easy integration into circuit boards, simplifying the assembly process.

Package Shape: SQUARE

The square shape helps in efficient use of space on the circuit board, maximizing design flexibility.

Nominal Supply Voltage (Vsup): 2.5 V

The specified supply voltage ensures optimal performance of the semiconductor in various electronic systems.

Power Supplies (V): 2.5

With a steady power supply of 2.5V, this semiconductor offers stable and consistent operation.

No. of Terminals: 16

The high number of terminals enables connectivity to multiple components, enhancing functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile design saves space and allows for compact circuit board layouts.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this semiconductor suitable for a wide range of applications.

Terminal Finish: NICKEL GOLD

The nickel gold finish provides excellent conductivity, ensuring reliable connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting onto the circuit board.

Maximum Seated Height: 1 mm

The low seated height helps in space-constrained applications, offering versatility in design.

Width (mm): 3 mm

The compact width of 3mm allows for efficient use of space on the circuit board.

Other IC type: ANALOG CIRCUIT

This semiconductor is versatile with its analog circuit functionality, catering to a wide range of electronic applications.

Minimum Supply Voltage (Vsup): 2.16 V

With a low minimum supply voltage, this semiconductor is energy-efficient and cost-effective.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of damage during assembly, ensuring product integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering and long-term performance.

Length: 3 mm

The compact length of 3mm contributes to space-saving design and layout efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures durability and reliability in harsh operating environments.

Terminal Form: BUTT

The butt terminal form offers secure connections and ease of soldering during assembly.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for dense packing and high interconnect density on the circuit board.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate sensitivity to moisture, suitable for standard assembly processes.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance of 3.6V ensures versatility in different power supply configurations.

Technical Specifications

Other Function Semiconductors LIS331DLF attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBCC-B16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LIS331DLF Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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