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LIS331HHTR

STMicroelectronics

LIS331HHTR by STMicroelectronics

LIS331HHTR by STMicroelectronics is a 16-terminal chip carrier with a very thin profile. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 2.5V. Ideal for industrial applications requiring precise analog circuitry in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,780 parts In-Stock

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6,780

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Digiode

USA . 4,370 parts In-Stock

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4,370

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Vyrian

USA . 2,714 parts In-Stock

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2,714

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Classic Components Corporation

USA . 1,049 parts In-Stock

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1,049

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Anansix

USA . 524 parts In-Stock

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524

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Nova Conductors

Japan . 57 parts In-Stock

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57

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Sensible Micro Corp

USA . 30 parts In-Stock

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30

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Cyclops Electronics Ltd

UK . 4 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 277 parts In-Stock

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$2.133

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277

$2.133

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Aztec Data Supply Inc.

USA . 1,534 parts In-Stock

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$2.830

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1,534

$2.830

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Ampacity Inc.

Singapore . 710 parts In-Stock

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$5.500

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710

$5.500

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AZTECH Wire

Italy . 603 parts In-Stock

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$5.727

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603

$5.727

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

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$6.979

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$6.281

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2,254

$6.979

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$6.281

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Semicontronic

India . 1,078 parts In-Stock

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$7.500

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$7.312

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$7.275

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$7.500

$7.312

$7.275

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MKK Technologies

India . 2,352 parts In-Stock

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$13.124

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2,352

$13.124

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DigiPath Technology Company

USA . 2,352 parts In-Stock

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$13.124

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$13.124

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RC Electronics

USA . 31,886 parts In-Stock

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31,886

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,712 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 4,852 parts In-Stock

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4,852

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Futuretech Components

Singapore . 4,000 parts In-Stock

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4,000

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Assy Fe

Spain . 2,841 parts In-Stock

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Lixinc

USA . 1,928 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,869 parts In-Stock

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Argo Parts USA

USA . 1,447 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,246 parts In-Stock

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Parana Technologies

USA . 1,217 parts In-Stock

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$8.345

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$8.345

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience the superior quality and reliability of the LIS331HHTR by STMicroelectronics, a leading manufacturer in the semiconductor industry. This versatile chip carrier, with a very thin profile, is designed for a wide range of applications in the industrial sector. Offering a nominal supply voltage of 2.5V and a wide operating temperature range, this analog circuit ensures optimal performance in any environment. Trust in STMicroelectronics to deliver cutting-edge technology that provides unparalleled value, benefits, and advantages to meet your specific needs. Choose the LIS331HHTR for top-notch quality and performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good thermal conductivity and electrical insulation, making the product durable and reliable.

Nominal Supply Voltage (Vsup): 2.5 V

Operates at a standard supply voltage of 2.5V, providing compatibility with a wide range of electronic devices.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, making it suitable for industrial applications.

Terminal Finish: Nickel/Gold (Ni/Au)

Nickel/Gold terminal finish ensures good conductivity and corrosion resistance, enhancing the overall performance of the product.

Width (mm): 3 mm

Compact size with a width of 3mm allows for easy integration into various electronic systems.

Other IC type: ANALOG CIRCUIT

Analog circuit design provides accurate and stable voltage regulation, making it ideal for precision applications.

Technical Specifications

Other Function Semiconductors LIS331HHTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBCC-B16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Gold (Ni/Au)

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LIS331HHTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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