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LIS331DLH

STMicroelectronics

LIS331DLH by STMicroelectronics

LIS331DLH by STMicroelectronics is a 16-terminal chip carrier with a supply voltage range of 2.16V to 3.6V and operating temperatures from -40°C to 85°C. This analog circuit in square package shape is ideal for industrial applications requiring precise motion sensing capabilities at a compact size. With surface mount capability and moisture sensitivity level of 3, it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 99,000 parts In-Stock

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99,000

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Vyrian

USA . 7,951 parts In-Stock

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7,951

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Digiode

USA . 4,477 parts In-Stock

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4,477

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Anansix

USA . 1,814 parts In-Stock

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1,814

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HZD GmbH

Germany . 500 parts In-Stock

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500

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Cyclops Electronics Ltd

UK . 152 parts In-Stock

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152

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Netsource Technology, Inc.

USA . 97 parts In-Stock

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97

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Cogito LLC

Ukraine . 60 parts In-Stock

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60

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LWI Electronics Inc

India . 40 parts In-Stock

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40

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Inventory MP

USA . 4 parts In-Stock

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4

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 337 parts In-Stock

1+ parts

$3.694

100+ parts

-

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337

$3.694

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AZTECH Wire

Italy . 825 parts In-Stock

1+ parts

$5.453

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825

$5.453

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Semicontronic

India . 991 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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991

$6.500

$6.338

$6.305

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Ampacity Inc.

Singapore . 415 parts In-Stock

1+ parts

$6.500

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415

$6.500

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IDEA Electronic Components Group

UK . 2,037 parts In-Stock

1+ parts

$9.265

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$8.339

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2,037

$9.265

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$8.339

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$11.330

100+ parts

$10.764

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$10.764

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3,000

$11.330

$10.764

$10.764

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MKK Technologies

India . 1,755 parts In-Stock

1+ parts

$17.423

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1,755

$17.423

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DigiPath Technology Company

USA . 1,755 parts In-Stock

1+ parts

$17.423

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$17.423

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Aztec Data Supply Inc.

USA . 4,387 parts In-Stock

1+ parts

$19.050

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4,387

$19.050

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Assy Fe

Spain . 130,267 parts In-Stock

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130,267

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GreenTree Electronics

Israel . 50,000 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,179 parts In-Stock

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7,179

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Continental Prestige Electronics

USA . 6,181 parts In-Stock

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Kepictronics

USA . 5,354 parts In-Stock

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5,354

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Alle Elektronik GmbH

Germany . 4,786 parts In-Stock

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4,786

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Corphita

USA . 3,328 parts In-Stock

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Lixinc

USA . 3,226 parts In-Stock

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Argo Parts USA

USA . 2,571 parts In-Stock

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2,571

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Parana Technologies

USA . 2,364 parts In-Stock

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$11.078

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2,364

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$11.078

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RC Electronics

USA . 1,885 parts In-Stock

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1,885

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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S.R.D Solutions

India . 1,000 parts In-Stock

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1,000

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Speed Components Ltd (Excess)

Israel . 19 parts In-Stock

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19

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Overview

Discover the LIS331DLH by STMicroelectronics, a cutting-edge product in the category of Other Function Semiconductors. With high-quality manufacturing and a reputation for excellence, STMicroelectronics delivers unmatched value to customers. This versatile chip carrier offers a wide range of applications, from industrial to consumer electronics, providing benefits such as precision performance and reliability. Trust STMicroelectronics to bring innovation and efficiency to your projects with the LIS331DLH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving.

Package Shape: SQUARE

The square package shape ensures efficient use of board space.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5V nominal supply voltage provides consistent power to the device.

Power Supplies (V): 2.5

The 2.5V power supply ensures optimal performance of the product.

No. of Terminals: 16

With 16 terminals, this product offers versatility in connectivity options.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced protection for the internal components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can withstand cold conditions.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact design.

Width (mm): 3 mm

The 3mm width makes this product suitable for applications with limited space.

Other IC type: ANALOG CIRCUIT

The analog circuit type offers precise and accurate signal processing.

Minimum Supply Voltage (Vsup): 2.16 V

The 2.16V minimum supply voltage ensures stable operation even at lower power levels.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures efficient soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable solder joints.

Length: 3 mm

The 3mm length of the product contributes to its compact design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for harsh operating conditions.

Terminal Form: BUTT

The butt terminal form simplifies the connection process.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers versatility in PCB design and layout.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product can withstand moderate moisture exposure.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage offers flexibility in power input requirements.

Technical Specifications

Other Function Semiconductors LIS331DLH attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBCC-B16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.16 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LIS331DLH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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