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FIS1100

Onsemi

FIS1100 by Onsemi

FIS1100 by Onsemi is a SQUARE GRID ARRAY IC with 16 terminals, operating at -40 to 85 °C. It has a Vsup range of 2.4-3V and measures 3.3x3.3mm, suitable for INDUSTRIAL applications requiring ANALOG CIRCUITS in compact designs with surface mount capabilities.

Median Price

$2.934

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,757 parts In-Stock

1+ parts

$1.670

100+ parts

$1.231

1k+ parts

$1.171

10k+ parts

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1,757

$1.670

$1.231

$1.171

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Arrow

USA . 1,756 parts In-Stock

1+ parts

$2.593

100+ parts

$2.435

1k+ parts

$2.317

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1,756

$2.593

$2.435

$2.317

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Farnell

UK . 620 parts In-Stock

1+ parts

$3.275

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620

$3.275

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Verical

USA . 1,756 parts In-Stock

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$2.435

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$2.317

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1,756

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$2.435

$2.317

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Rochester

USA . 529 parts In-Stock

1+ parts

-

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$3.760

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$3.370

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$3.170

529

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$3.760

$3.370

$3.170

DigiKey

USA . 529 parts In-Stock

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$4.940

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529

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$4.940

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,353 parts In-Stock

1+ parts

$1.244

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2,353

$1.244

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Nova Conductors

Japan . 15 parts In-Stock

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$3.061

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15

$3.061

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Chip Stock

USA . 42,000 parts In-Stock

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Vyrian

USA . 829 parts In-Stock

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DigiKey Marketplace

USA . 620 parts In-Stock

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620

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Prism Electronics

USA . 112 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,078 parts In-Stock

1+ parts

$1.050

100+ parts

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1,078

$1.050

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Corphita

USA . 2,135 parts In-Stock

1+ parts

$1.179

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2,135

$1.179

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Corohmni

South Africa . 441 parts In-Stock

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$1.231

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441

$1.231

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Semicontronic

India . 1,109 parts In-Stock

1+ parts

$2.280

100+ parts

$2.223

1k+ parts

$2.212

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1,109

$2.280

$2.223

$2.212

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Continental Prestige Electronics

USA . 620 parts In-Stock

1+ parts

$2.530

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620

$2.530

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.000

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$2.880

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100

$3.000

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$2.880

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Argo Parts USA

USA . 7 parts In-Stock

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$3.061

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7

$3.061

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$3.153

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$2.995

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$2.995

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1,000

$3.153

$2.995

$2.995

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Aztec Data Supply Inc.

USA . 697 parts In-Stock

1+ parts

$12.120

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$12.120

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Component Stockers USA

USA . 550 parts In-Stock

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$99.990

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$99.990

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Kulean Microsystems

USA . 6,430 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,653 parts In-Stock

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Emar International I/E

Canada . 3,749 parts In-Stock

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Problanco Electronics

Mexico . 2,909 parts In-Stock

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Robosynatics

Brazil . 1,778 parts In-Stock

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Lucentia Tech

USA . 1,778 parts In-Stock

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TANS Electronics

Latvia . 1,354 parts In-Stock

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Kepictronics

USA . 1,136 parts In-Stock

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UHIMA Technologies

Türkiye . 705 parts In-Stock

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705

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Supply Digital

USA . 279 parts In-Stock

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279

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Overview

Discover the innovative FIS1100 by Onsemi, a high-quality semiconductor with endless possibilities. Manufactured by Onsemi, a trusted leader in the industry, this product offers unparalleled value and benefits to customers. Ideal for a variety of applications, this square-shaped surface mount device boasts 16 terminals and operates efficiently in a wide temperature range. Experience the advantages of the FIS1100 and unlock the potential for your projects today.

Feature Benefit Bullets

Surface Mount - YES

Allows for easy and efficient PCB assembly, reducing manufacturing time and cost.

Nominal Supply Voltage (Vsup) - 2.7 V

Optimal voltage level for stable and reliable operation of the device.

Maximum Operating Temperature - 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature -40 °C

High tolerance to low temperatures, suitable for a wide range of operating environments.

Width (mm) - 3.3 mm

Compact size allows for integration into smaller devices or spaces.

Technical Specifications

Other Function Semiconductors FIS1100 attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XBGA-B16

Length:

3.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.3 mm

Trade Compliance

FIS1100 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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