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XTR117AIDRBT

Texas Instruments

XTR117AIDRBT by Texas Instruments

XTR117AIDRBT by Texas Instruments is a small outline, heat sink package with 8 terminals. It operates b/w -40 to 125 °C and has a supply voltage range of 7.5V to 40V, making it ideal for automotive applications requiring low power consumption. This analog circuit IC features a bipolar technology and is suitable for surface mount assembly with a moisture sensitivity level of 3.

Median Price

$1.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 438 parts In-Stock

1+ parts

$1.120

100+ parts

$1.100

1k+ parts

$1.080

10k+ parts

-

438

$1.120

$1.100

$1.080

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Distributors (In-Stock)

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Digiode

USA . 2,056 parts In-Stock

1+ parts

$1.064

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-

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2,056

$1.064

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Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$1.750

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52

$1.750

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Mobius Materials

USA . 358 parts In-Stock

1+ parts

$3.090

100+ parts

$2.470

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358

$3.090

$2.470

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Chip Stock

USA . 20,170 parts In-Stock

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Vyrian

USA . 3,326 parts In-Stock

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3,326

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Distributors (Availability)

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Ampacity Inc.

Singapore . 199 parts In-Stock

1+ parts

$0.950

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199

$0.950

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Semicontronic

India . 138 parts In-Stock

1+ parts

$0.950

100+ parts

$0.926

1k+ parts

$0.922

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138

$0.950

$0.926

$0.922

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Corphita

USA . 893 parts In-Stock

1+ parts

$1.008

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-

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893

$1.008

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Argo Parts USA

USA . 4,702 parts In-Stock

1+ parts

$1.530

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4,702

$1.530

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Continental Prestige Electronics

USA . 4,702 parts In-Stock

1+ parts

$1.530

100+ parts

-

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$1.499

4,702

$1.530

-

-

$1.499

Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

$1.698

100+ parts

$1.681

1k+ parts

$1.630

10k+ parts

-

750

$1.698

$1.681

$1.630

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

$1.662

10k+ parts

$1.628

2,000

$1.750

-

$1.662

$1.628

Parana Technologies

USA . 952 parts In-Stock

1+ parts

$1.829

100+ parts

-

1k+ parts

$2.381

10k+ parts

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952

$1.829

-

$2.381

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ChromeModa Solutions

Germany . 4,082 parts In-Stock

1+ parts

$2.055

100+ parts

$1.685

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-

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4,082

$2.055

$1.685

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$2.055

100+ parts

-

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$1.850

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1,457

$2.055

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$1.850

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Corohmni

South Africa . 147 parts In-Stock

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$3.354

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147

$3.354

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Microchip USA

USA . 217 parts In-Stock

1+ parts

$3.480

100+ parts

$3.470

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$3.470

10k+ parts

$3.460

217

$3.480

$3.470

$3.470

$3.460

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$17.642

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709

$17.642

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$20.733

100+ parts

$19.696

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$19.696

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500

$20.733

$19.696

$19.696

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Lixinc

USA . 11,292 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,948 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 1,305 parts In-Stock

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$1.853

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1,305

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$1.853

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iodParts Technologies Inc.

India . 500 parts In-Stock

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500

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

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$15.901

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$15.901

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$15.901

300

-

$15.901

$15.901

$15.901

Kepictronics

USA . 170 parts In-Stock

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170

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Overview

Experience unparalleled quality and reliability with the XTR117AIDRBT by Texas Instruments. As a leading manufacturer in the semiconductor industry, Texas Instruments delivers cutting-edge solutions for various applications. The XTR117AIDRBT offers customers exceptional value with its high-performance capabilities and innovative design. Whether you're looking to enhance your automotive systems or improve industrial processes, this product provides unmatched benefits and advantages. Trust Texas Instruments to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the semiconductor, making it suitable for various applications.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape:

SQUARE - Offers a compact and space-saving design, ideal for applications where size is a critical factor.

Nominal Supply Voltage (Vsup):

24 V - Provides a stable power source for the semiconductor to operate efficiently and reliably.

Power Supplies (V):

24 - Matches the nominal supply voltage, ensuring compatibility and optimal performance.

No. of Terminals:

8 - Offers multiple connection points for interfacing with other components, increasing versatility in circuit design.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - Enhances heat dissipation and allows for installation in tight spaces without compromising performance.

Maximum Operating Temperature:

125 °C - Ensures the semiconductor can withstand high operating temperatures, suitable for demanding environments.

Minimum Operating Temperature:

40 °C - Provides a wide temperature range for operation, making it suitable for both extreme hot and cold conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Offers corrosion resistance and reliable electrical connections, ensuring long-term performance.

Terminal Position:

DUAL - Provides redundancy and flexibility in connecting the semiconductor within a circuit layout.

Maximum Seated Height:

1 mm - Low-profile design allows for utilization in compact devices or applications with height constraints.

Width (mm):

3 mm - Compact width contributes to a space-saving design, ideal for applications with limited board space.

Other IC type:

ANALOG CIRCUIT - Offers analog signal processing capabilities, suitable for applications requiring accurate and precise signal processing.

Minimum Supply Voltage (Vsup):

7.5 V - Provides a range of supply voltages for flexibility in power input requirements.

Peak Reflow Temperature °C:

260 - Withstands high reflow temperatures during manufacturing processes, ensuring reliability during assembly.

Length:

3 mm - Compact length contributes to a space-saving design, ideal for applications with limited board space.

Temperature Grade:

AUTOMOTIVE - Meets automotive industry standards for reliability and performance, suitable for automotive applications.

Maximum Supply Current (Isup):

0.25 mA - Low supply current consumption ensures energy efficiency and reduces power dissipation.

Technology:

BIPOLAR - Utilizes bipolar technology for high-performance analog processing capabilities, suitable for precision circuit applications.

Terminal Form:

NO LEAD - Lead-free terminal form for compliance with environmental regulations and RoHS standards.

Terminal Pitch:

0.65 mm - Provides fine pitch terminals for high-density circuit designs, maximizing board space and functionality.

Moisture Sensitivity Level (MSL):

3 - Indicates moderate moisture sensitivity, ensuring the semiconductor's reliability in various environmental conditions.

Maximum Supply Voltage (Vsup):

40 V - Supports a wide supply voltage range, accommodating a variety of power input requirements for different applications.

Technical Specifications

Other Function Semiconductors XTR117AIDRBT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

7.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

XTR117AIDRBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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