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FDC1004DSCT

Texas Instruments

FDC1004DSCT by Texas Instruments

FDC1004DSCT by Texas Instruments is a 10-terminal analog circuit IC with a supply voltage range of 3-3.6V, operating b/w -40 to 125°C. This small outline package with surface mount feature and dual terminal position is ideal for automotive applications requiring precise sensing in a compact form factor.

Median Price

$4.673

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 73 parts In-Stock

1+ parts

$4.570

100+ parts

$3.524

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-

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73

$4.570

$3.524

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Arrow

USA . 73 parts In-Stock

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$4.776

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$3.449

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73

$4.776

$3.449

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Verical

USA . 245 parts In-Stock

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$6.570

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$3.550

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245

$6.570

$3.550

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Mouser Electronics

USA . 166 parts In-Stock

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$3.800

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$3.770

166

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$3.770

Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.060

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1,000

$4.060

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Digiode

USA . 3,135 parts In-Stock

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$4.342

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3,135

$4.342

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Bristol Electronics

USA . 6,199 parts In-Stock

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Vyrian

USA . 2,346 parts In-Stock

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2,346

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ComSIT Distribution GmbH

Germany . 94 parts In-Stock

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94

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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10

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Semi Source

USA . 9 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 166 parts In-Stock

1+ parts

$3.230

100+ parts

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166

$3.230

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Semicontronic

India . 166 parts In-Stock

1+ parts

$3.230

100+ parts

$3.149

1k+ parts

$3.133

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166

$3.230

$3.149

$3.133

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Continental Prestige Electronics

USA . 5,626 parts In-Stock

1+ parts

$4.060

100+ parts

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$3.979

5,626

$4.060

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-

$3.979

Argo Parts USA

USA . 2,792 parts In-Stock

1+ parts

$4.060

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2,792

$4.060

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Netroflash

USA . 100 parts In-Stock

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$4.060

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100

$4.060

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Corphita

USA . 2,441 parts In-Stock

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$4.113

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2,441

$4.113

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Microchip USA

USA . 1,013 parts In-Stock

1+ parts

$7.770

100+ parts

$7.720

1k+ parts

$7.700

10k+ parts

$7.680

1,013

$7.770

$7.720

$7.700

$7.680

Corohmni

South Africa . 643 parts In-Stock

1+ parts

$8.295

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643

$8.295

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AZTECH Wire

Italy . 231 parts In-Stock

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$12.476

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231

$12.476

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$20.067

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$19.064

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$19.064

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600

$20.067

$19.064

$19.064

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Parana Technologies

USA . 1,420 parts In-Stock

1+ parts

$21.072

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$21.323

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1,420

$21.072

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$21.323

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DigiPath Technology Company

USA . 531 parts In-Stock

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$23.202

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$21.346

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531

$23.202

$21.346

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ChromeModa Solutions

Germany . 3,367 parts In-Stock

1+ parts

$23.676

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$19.414

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3,367

$23.676

$19.414

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$23.676

100+ parts

$22.492

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$21.308

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2,343

$23.676

$22.492

$21.308

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Lixinc

USA . 16,789 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,878 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,585 parts In-Stock

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4,585

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Perfect Parts

USA . 280 parts In-Stock

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280

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Kepictronics

USA . 190 parts In-Stock

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190

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Overview

Elevate your electronic designs with the FDC1004DSCT by Texas Instruments, a top-of-the-line semiconductor offering unparalleled quality and reliability. Manufactured by a trusted industry leader, this versatile device is ideal for a wide range of applications in various industries. With its compact design and advanced features, this product delivers exceptional value and performance, making it the perfect choice for customers looking to take their projects to the next level. Experience the benefits and advantages that the FDC1004DSCT has to offer and see your creations soar to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto circuit boards, saving time and cost in manufacturing.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a commonly used standard in many electronic devices, making this product compatible with a wide range of applications.

No. of Terminals: 10

Having 10 terminals allows for more connections and functionality, increasing the versatility of the semiconductor.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this semiconductor can withstand harsh environments and high temperature conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the semiconductor can perform reliably in both extreme cold and hot conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good conductivity and solderability, ensuring secure connections in the circuit.

No. of Channels: 4

Having 4 channels allows for multiple inputs and outputs, enabling more complex functions and operations to be performed.

Technical Specifications

Other Function Semiconductors FDC1004DSCT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Total Dose (V):

Width (mm):

3 mm

Trade Compliance

FDC1004DSCT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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