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MPU-9250

Invensense

MPU-9250 by Invensense

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Vyrian

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Nova Conductors

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Semi Source

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Cyclops Electronics Ltd

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Bristol Electronics

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Lantek

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Atlantic Semiconductor

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Prism Electronics

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NexGen Digital

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Semicontronic

India . 374 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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AZTECH Wire

Italy . 267 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 615 parts In-Stock

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Technoshack Inc. (Excess)

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Continental Prestige Electronics

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GreenTree Electronics

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Argo Parts USA

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

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Bastille Electronics

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Lucentia Tech

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Robosynatics

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Overview

The MPU-9250 by Invensense is a game-changer in the world of semiconductors. With its cutting-edge technology and precision engineering, this chip offers unparalleled quality and reliability. From industrial applications to consumer electronics, the MPU-9250 delivers exceptional performance, accuracy, and efficiency. Trust in Invensense's legacy of innovation and choose the MPU-9250 for all your semiconductor needs. Unlock endless possibilities with this remarkable product today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation and compact design, making it suitable for a variety of applications.

Package Shape: SQUARE

Square shape enables efficient use of space on the PCB and promotes better heat dissipation.

Nominal Supply Voltage (Vsup): 2.5 V

Stable supply voltage ensures reliable performance and compatibility with various systems.

No. of Terminals: 24

Sufficient number of terminals for connectivity and functionality options in the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Combination of chip carrier and heat sink/slug package style enhances thermal management and component protection.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme conditions and enhances product durability.

Terminal Position: QUAD

Quad terminal position facilitates easier PCB layout and assembly process.

Maximum Seated Height: 1.05 mm

Low seated height minimizes space requirements and enables slim designs.

Width (mm): 3 mm

Compact width allows for flexibility in circuit design and integration into various systems.

Other IC type: ANALOG CIRCUIT

Analog circuit type provides accurate signal processing and compatibility for analog applications.

Minimum Supply Voltage (Vsup): 2.4 V

Low minimum supply voltage enables operation in low-power environments while maintaining performance.

Length: 3 mm

Short length enhances space-saving capabilities and promotes efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments and industrial settings.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and compact circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage provides versatility in power supply options and compatibility with a wide range of systems.

Technical Specifications

Other Function Semiconductors MPU-9250 attributes and parameters. Explore more Other Function Semiconductors devices from Invensense

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N24

Length:

3 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

MPU-9250 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Invensense

InvenSense, a TDK Group Company, is a world leading provider of MEMS sensor platforms found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. The company’s patented Fabrication Platform, MotionFusion® technology, audio solutions, and location software and services addresses the emerging need of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- sound-, and ultrasonic 3D- based interfaces. In May of 2017, InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation. TDK currently focuses on three market segments: automotive, industrial equipment & energy, and information & communications technology (ICT). As part of its strategy for growth in these key areas, TDK has identified sensors and actuators, energy units and next-generation electronic components as three product areas for strategic growth aimed at unlocking new business opportunities in the sphere of the Internet of Things (IoT). Sensors are viewed as an important IoT-enabling technology, and sensor products and the technology portfolio of TDK will expand dramatically as a result of its acquisition of InvenSense. MotionTracking solutions are rapidly becoming key functions in every consumer electronics device as it provides a more intuitive way for consumers to interact with their electronic devices by tracking their motions in free space and delivering these motions as input commands. Audio is similarly becoming complementary to motion as a means for interacting with contextually aware devices and applications. InvenSense’s vision is to be the leading provider of sensor Systems on Chips (SoC) platform solutions providing an ‘AlwaysOn’ solution by enabling the most seamless sensing experience at the lowest power. InvenSense’s microphone portfolio builds on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications. InvenSense’s MotionTracking portfolio of products and services accurately tracks complex user motions, requiring the use of motion sensors such as gyroscopes, accelerometers, compasses, and pressure sensors, properly calibrating the data, and then fusing the sensor outputs into a single and accurate data stream for use by motion applications. InvenSense delivers turn-key solutions with fully integrated MotionTracking devices, robust MotionFusion algorithms, and in-use calibration firmware. The company’s patented fabrication process is the key technology which enables direct integration of MEMS mechanical structures with CMOS electronics at the wafer level. InvenSense MotionTracking technology is comprised of five core proprietary elements: the Fabrication process, advanced MEMS motion sensor designs, application specific mixed-signal circuitry for sensor signal processing, MotionFusion algorithms and calibration firmware that intelligently assimilates data from multiple sensors for use by end applications, and the MotionApps™ platform of drivers and application programming interfaces (APIs). Although all five elements are critical to providing a complete MotionProcessing solution, the patented Fabrication platform is the core differentiating technology. As a result of our modular and scalable platform architecture, our current and planned products span increasing levels of integration, from standalone single-chip gyroscopes to fully integrated sensor system on chip (SoC) MotionTracking solutions. Founded in 2003, InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy.

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