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L9349DIE1

STMicroelectronics

L9349DIE1 by STMicroelectronics

L9349DIE1 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and supports 4 functions. It features built-in transient and thermal protections, making it ideal for robust applications. With a fast turn-on time of 25µs, it's perfect for efficient control in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,417 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,417

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-

-

-

Digiode

USA . 1,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,228

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-

-

-

Vyrian

USA . 997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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997

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,178 parts In-Stock

1+ parts

$13.084

100+ parts

-

1k+ parts

$11.776

10k+ parts

-

1,178

$13.084

-

$11.776

-

MKK Technologies

India . 912 parts In-Stock

1+ parts

$24.604

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$24.604

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-

-

DigiPath Technology Company

USA . 912 parts In-Stock

1+ parts

$24.604

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$24.604

-

-

-

Corphita

USA . 2,890 parts In-Stock

1+ parts

-

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2,890

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-

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Parana Technologies

USA . 677 parts In-Stock

1+ parts

-

100+ parts

$15.644

1k+ parts

-

10k+ parts

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677

-

$15.644

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-

Overview

Elevate your designs with the L9349DIE1 from STMicroelectronics, a leader in innovation and quality. This versatile peripheral driver seamlessly integrates into a variety of applications, delivering robust performance with built-in protections against transients and thermal events. Enjoy peace of mind and enhanced efficiency, knowing you have a reliable partner from a trusted manufacturer that prioritizes excellence. Transform your projects with the benefits of unparalleled reliability and superior functionality!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of PCB space, enabling compact and flexible circuit layouts.

Maximum Supply Voltage: 32 V

A maximum supply voltage of 32 V provides a wide operating range, making the product suitable for various applications and requiring fewer voltage regulation components.

No. of Functions: 4

With 4 functions integrated into a single package, this product simplifies design and reduces component count, saving both space and cost.

Package Shape: RECTANGULAR

The rectangular package shape allows for a streamlined layout on PCBs, aiding in effective thermal management and mechanical stability.

Built-in Protections: TRANSIENT; THERMAL

Built-in transient and thermal protections enhance the reliability of the product, ensuring longevity and robustness in demanding environments.

No. of Terminals: 19

Having 19 terminals enables multiple connection points for versatility in connections and integrating with a variety of systems.

Package Style (Meter): UNCASED CHIP

The uncashed chip allows for flexibility in mounting and integration into custom designs, as well as potential reduction in overall product weight.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V supports low-voltage applications, enhancing compatibility with modern digital devices.

Terminal Position: UPPER

Upper terminal positioning facilitates easier access for connections, leading to simplified assembly and servicing of the device.

Technology: BCD

BCD technology contributes to high-efficiency operation and robustness, making this peripheral driver suitable for a range of applications.

Terminal Form: NO LEAD

The no-lead design minimizes the footprint, allowing for a more compact assembly; optimal for space-constrained applications.

Nominal Supply Voltage: 12 V

A nominal supply voltage of 12 V aligns well with standard power systems, making it easy to implement within existing designs.

Turn-on Time: 25 us

A quick turn-on time of 25 microseconds ensures rapid response in applications, enhancing overall system performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface type optimizes signal integrity and conditioning, important for reliable communication in peripheral devices.

Turn-off Time: 30 us

The relatively short turn-off time minimizes delays in signal processing, which is critical for time-sensitive applications.

Output Current Flow Direction: SINK

Output current sink capability allows for direct connection to ground-referenced loads, streamlining the design and improving reliability.

Technical Specifications

Peripheral Drivers L9349DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-XUUC-N19

No. of Functions:

4

No. of Terminals:

19

Output Current Flow Direction:

SINK

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

30 us

Turn-on Time:

25 us

Trade Compliance

L9349DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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