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L9346PD

STMicroelectronics

L9346PD by STMicroelectronics

L9346PD by STMicroelectronics is a Peripheral Driver with 4 functions, 32V max supply voltage, and built-in transient protection. It is used for buffering or inverting signals in applications requiring a nominal 12V supply voltage and peak current limit of 10A. The driver has a small outline package style with gull wing terminals, making it suitable for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,635

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-

-

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Vyrian

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,785

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-

-

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Anansix

USA . 1,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

-

-

-

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ComSIT Distribution GmbH

Germany . 506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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506

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 425 parts In-Stock

1+ parts

$7.596

100+ parts

-

1k+ parts

$6.837

10k+ parts

-

425

$7.596

-

$6.837

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MKK Technologies

India . 361 parts In-Stock

1+ parts

$14.285

100+ parts

-

1k+ parts

-

10k+ parts

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361

$14.285

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-

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DigiPath Technology Company

USA . 361 parts In-Stock

1+ parts

$14.285

100+ parts

-

1k+ parts

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10k+ parts

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361

$14.285

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Corphita

USA . 444 parts In-Stock

1+ parts

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444

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Parana Technologies

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$9.083

1k+ parts

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10k+ parts

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41

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$9.083

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Overview

Enhance your projects with the high-quality L9346PD peripheral driver by STMicroelectronics. With built-in protections against transient, over current, and thermal issues, this versatile device offers reliable performance in a compact package. Ideal for a wide range of applications, this driver provides 4 functions to meet your project needs. Trust in the expertise of STMicroelectronics to deliver innovative solutions that add value to your designs. Upgrade your systems today with the L9346PD and experience the benefits of enhanced performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into circuit boards.

Maximum Supply Voltage: 32 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

No. of Functions: 4

Having multiple functions in one device helps simplify circuit design and saves space on the board.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections ensure the safety and reliability of the peripheral driver and connected components.

Power Supplies (V): 4.5/32

The wide range of power supply voltage options makes this driver versatile and adaptable to different power sources.

No. of Terminals: 20

Having 20 terminals allows for connection to multiple input and output devices, increasing usability.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slub design helps in efficient heat dissipation and space-saving on the board.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides reliability and solderability for secure connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connecting the peripheral driver to other components in the circuit.

Maximum Seated Height: 3.6 mm

The low seated height helps in fitting the driver in compact spaces without compromising performance.

Width: 11 mm

The compact width of the driver enables easy integration into tight spaces on the circuit board.

Length: 15.9 mm

The moderate length of the driver provides a balance between functionality and space-saving on the board.

Technology: BCD

The BCD technology used in the driver ensures efficient performance and compatibility with various systems.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering during installation.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V is a common standard in many systems, ensuring compatibility and ease of use.

Turn-on Time: 25 us

The fast turn-on time ensures quick response and operation of the peripheral driver.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close spacing between terminals, increasing connectivity options on the board.

Driver No. of Bits: 4

The 4-bit driver provides sufficient control and precision in managing peripheral devices in the circuit.

Nominal Output Peak Current Limit: 10 A

The high peak current limit ensures the driver can handle demanding applications and devices effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Having a buffer or inverter based interface IC type provides flexibility in controlling various types of devices in the circuit.

Turn-off Time: 30 us

The short turn-off time ensures efficient switching off of the driver, enhancing overall performance in the system.

Output Current Flow Direction: SINK

The sink output current flow direction allows for easy connection to devices that require current sinking, expanding compatibility.

Technical Specifications

Peripheral Drivers L9346PD attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

30 us

Turn-on Time:

25 us

Width:

11 mm

Trade Compliance

L9346PD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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