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L9348-DIE1

STMicroelectronics

L9348-DIE1 by STMicroelectronics

L9348-DIE1 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V and built-in protections against transients, overcurrent, and thermal issues. It features 4 functions in a compact no-lead package. Ideal for buffer or inverter applications, it ensures efficient performance with quick turn-on (20µs) and turn-off (30µs) times.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,183

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-

-

-

Digiode

USA . 3,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,168

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-

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Anansix

USA . 1,207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,207

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,886 parts In-Stock

1+ parts

$11.012

100+ parts

-

1k+ parts

$9.911

10k+ parts

-

1,886

$11.012

-

$9.911

-

MKK Technologies

India . 1,236 parts In-Stock

1+ parts

$20.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$20.708

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-

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DigiPath Technology Company

USA . 1,236 parts In-Stock

1+ parts

$20.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$20.708

-

-

-

Parana Technologies

USA . 2,044 parts In-Stock

1+ parts

-

100+ parts

$13.167

1k+ parts

-

10k+ parts

-

2,044

-

$13.167

-

-

Corphita

USA . 530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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530

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Overview

Elevate your designs with the L9348-DIE1 from STMicroelectronics, a leader in innovation and quality. This versatile peripheral driver offers unmatched reliability and built-in protections against transient spikes, overcurrent, and thermal issues. With its robust design for surface mount applications, it seamlessly integrates into diverse projects, providing exceptional performance and efficiency. Trust in STMicroelectronics to empower your next breakthrough!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 18 V

With a maximum supply voltage of 18 V, this product can handle a variety of applications, providing flexibility in design.

No. of Functions: 4

Having four functions ensures versatility, making it suitable for different peripheral driving requirements.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for reflow soldering and efficient use of circuit board space.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Integrated protections enhance reliability, safeguarding against damage caused by electrical surges, overcurrent, and overheating.

No. of Terminals: 21

A higher number of terminals allows for more connections, which can facilitate complex circuit designs.

Package Style (Meter): UNCASED CHIP

The unencased chip style can reduce weight and size, ideal for compact device applications.

Minimum Supply Voltage: 4.8 V

A minimum supply voltage of 4.8 V ensures compatibility with a wide range of low-power applications.

Terminal Position: UPPER

Upper terminal positioning aids in efficient use of space and simplifies routing on PCBs.

Technology: BCD

BCD technology improves performance and power efficiency, making it suitable for power-sensitive projects.

Terminal Form: NO LEAD

No lead design reduces the risk of physical damage and enhances reliability in compact applications.

Turn-on Time: 20 us

A fast turn-on time ensures timely response in driving peripherals, improving overall system performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter type, it provides versatility for various interfacing needs in peripheral driving tasks.

Turn-off Time: 30 us

The quick turn-off time minimizes power waste and enhances efficiency in dynamic applications.

Output Current Flow Direction: SOURCE

The ability to source current allows it to effectively drive connected peripherals, improving functional efficacy.

Technical Specifications

Peripheral Drivers L9348-DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-XUUC-N21

No. of Functions:

4

No. of Terminals:

21

Output Current Flow Direction:

SOURCE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

4.8 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

30 us

Turn-on Time:

20 us

Trade Compliance

L9348-DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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