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L9346DIE

STMicroelectronics

L9346DIE by STMicroelectronics

STMicroelectronics L9346DIE is a RECTANGULAR UNCASED CHIP with 28 terminals. It operates at 4.5-32 V, offering built-in protections against TRANSIENT, OVER CURRENT, and THERMAL issues. This BUFFER/INVERTER BASED PERIPHERAL DRIVER has a fast turn-on/off time of 25/30 us, making it ideal for applications requiring high-speed output current sinking.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,185

-

-

-

-

Anansix

USA . 1,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,943

-

-

-

-

Vyrian

USA . 1,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,718

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,045 parts In-Stock

1+ parts

$12.518

100+ parts

-

1k+ parts

$11.266

10k+ parts

-

1,045

$12.518

-

$11.266

-

MKK Technologies

India . 1,783 parts In-Stock

1+ parts

$23.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$23.538

-

-

-

DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

$23.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$23.538

-

-

-

Corphita

USA . 2,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,535

-

-

-

-

Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

-

100+ parts

$14.967

1k+ parts

-

10k+ parts

-

2,303

-

$14.967

-

-

Overview

Transform your electronic designs with the L9346DIE peripheral driver from STMicroelectronics. With built-in protections against transients, over current, and thermal issues, this rectangular-shaped, surface-mountable chip offers unparalleled reliability and safety for your applications. Whether you're working on automotive electronics, industrial control systems, or consumer electronics, this versatile peripheral driver with 4 functions will enhance the performance of your products. Trust in STMicroelectronics' reputation for quality and innovation, and experience the value and benefits that the L9346DIE brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for easy installation and saves space on the PCB, making the product more efficient and compact.

Maximum Supply Voltage: 32 V

With a high maximum supply voltage of 32 V, this peripheral driver can handle a wide range of power inputs, making it versatile and reliable.

No. of Functions: 4

Having 4 functions in one device reduces the need for multiple components, simplifying the design and saving costs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections ensure safety and reliability, protecting the peripheral driver and connected devices from damage in case of unexpected events.

No. of Terminals: 28

With 28 terminals, this peripheral driver offers flexibility in connectivity options, allowing for various configurations and applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V enables the peripheral driver to operate efficiently in low-power scenarios, making it energy-efficient.

Technology: BCD

Using BCD technology ensures high performance and compatibility with various systems, enhancing the overall functionality of the peripheral driver.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12 V is a common and widely available power source, making integration and operation of the peripheral driver convenient and accessible.

Turn-on Time: 25 us

The quick turn-on time of 25 us allows for rapid response and operation, improving the overall efficiency and performance of the peripheral driver.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The versatile interface IC type offers compatibility with different systems and devices, making this peripheral driver suitable for a wide range of applications.

Turn-off Time: 30 us

The fast turn-off time of 30 us ensures precise control and improved efficiency during operation, optimizing the performance of the peripheral driver.

Output Current Flow Direction: SINK

The sink output current flow direction is ideal for driving external loads, providing stability and reliability in controlling connected devices.

Technical Specifications

Peripheral Drivers L9346DIE attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-XUUC-N28

No. of Functions:

4

No. of Terminals:

28

Output Current Flow Direction:

SINK

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

30 us

Turn-on Time:

25 us

Trade Compliance

L9346DIE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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